Composable Flex Leak Sensor Sheet With Redundant PCB Tiles

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Solution Overview

Problem

Existing leak detection technologies in liquid-cooled computing racks require custom designs for each configuration, leading to logistical challenges and limited coverage, especially in densely packed data centers with varied server and power node topologies.

Innovation Solution

A scalable and composable flex leak sensor sheet composed of individual sensor tiles that can be connected and cut to form larger structures, providing extensive coverage and adaptability to various shapes and sizes, with redundant connections ensuring functionality even if some parts are damaged.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional leak detection ropes are used, then the system is simple to implement, but the coverage and sensitivity are limited

Engineering Contradiction:
Improveleak detection sensitivityVSAvoidsensor sheet structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The sensor sheet is divided into modular sensor tiles that can be independently connected and configured. Each tile contains conductive traces and sensing elements that can be arranged in specific patterns to optimize leak detection sensitivity for different applications while maintaining a standardized base structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sensor sheet is designed as a universal platform that can detect multiple types of leaks (liquid, coolant, condensation) and be configured for various shapes and sizes of containers or surfaces. The same basic tile structure serves multiple detection purposes through different trace patterns and arrangements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If custom designs are created for each rack configuration, then the leak detection coverage is optimized, but the manufacturing and logistics complexity increases

Engineering Contradiction:
Improveadaptability to various rack configurationsVSAvoidcustom design fabrication
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The sensor system is segmented into standardized tiles that can be mass-produced using uniform manufacturing processes. Different rack configurations are achieved by connecting these identical tiles in various patterns rather than creating custom designs for each application, simplifying manufacturing and inventory management.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sensor sheet incorporates flexible and reconfigurable connections between tiles, allowing the same set of standardized components to be dynamically arranged to match different rack configurations. This enables a single standardized design to adapt to multiple applications without requiring custom fabrication.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If the sensor sheet is made rigid for structural stability, then the manufacturing precision is improved, but the ability to conform to various shapes is reduced

Engineering Contradiction:
Improveconformability to various shapesVSAvoidsensor trace alignment
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The sensor sheet uses flexible printed circuit boards or thin film substrates that can bend and conform to irregular surfaces while maintaining precise trace alignment through controlled manufacturing processes. The flexibility is achieved through appropriate substrate selection and trace routing design that accommodates bending without compromising electrical connections.

Inventive Principle:
Principle #30Flexible shells and thin films

4Reliability

If redundant connections are added to each sensor tile, then the reliability under mechanical stress is improved, but the device complexity increases

Engineering Contradiction:
Improvetolerance to mechanical stressVSAvoidconnection structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Redundancy is implemented at the modular tile level rather than requiring complex overall system design. Each tile contains multiple independent conductive paths or trace patterns that can bypass damaged areas, providing localized redundancy that simplifies the overall connection structure while maintaining high reliability.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables rapid prototyping and customization for effective leak detection, offering greater coverage and sensitivity compared to traditional methods, while being cost-effective and reliable, particularly in data center environments with liquid cooling systems.

Implementation Method 1

The sensor sheet is composed of individual sensor tiles with conductive traces that detect liquid through electrical conduction

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20260036484A1Scalable and Composable Flex Leak Sensor Sheet
Publication Date: 2026.02.05 DELL PROD LP
  • US20260036484A1 patent drawing
  • US20260036484A1 patent drawing
  • US20260036484A1 patent drawing

AI summary

A scalable and composable flex leak sensor sheet composed of individual sensor tiles arranged in a matrix pattern. Each sensor tile features multiple redundant connections, ensuring functionality even if some traces are damaged. The sensor sheet is bendable and foldable, allowing the sensor sheet to conform to various shapes and sizes. The sensor tiles employ electrical traces on a flexible Printed Circuit Board (PCB). The sensor sheet can be cut into various shapes and connected to form larger composite structures. The first set of traces is located on the top side of the flexible PCB, and the second set of traces is located on the back side. The sensor sheet detects the presence of liquid by changing electrical properties when in contact with the liquid. The sensor tiles can be cut on three sides while maintaining electrical connectivity and functionality through the redundant connections.