Flex PCB Photonics Packaging for LiDAR Alignment and Signal Integrity

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Solution Overview

Problem

Packaging silicon photonics in LiDAR systems poses challenges due to mode field diameter mismatch, alignment tolerance issues, and compatibility problems, leading to increased costs and degraded performance from stress, crosstalk, and limited LiDAR range.

Innovation Solution

Integration of a flex-based printed circuit board (PCB) with silicon photonics integrated circuits (PICs) in LiDAR systems, using flex or rigid-flex PCBs to reduce stress and alignment issues, and eliminate separate cable assemblies, while incorporating ultra-low CTE materials and embedded ceramic carriers to manage thermal expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If traditional rigid PCB packaging is used for silicon photonics, then structural stability is provided, but stress on optical and electrical components increases and alignment precision deteriorates

Engineering Contradiction:

Improvestructural stabilityVSAvoidalignment precision

Core Design Contradiction:

Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The patent uses a flexible PCB instead of a rigid PCB to package silicon photonics components. The flexible nature of the PCB reduces stress on optical and electrical components while maintaining structural stability, thereby improving alignment precision without sacrificing structural integrity.

Inventive Principle:

Principle #30Flexible shells and thin films

2Adaptability or versatility

If separate cable assemblies are used for connecting PIC and EIC, then connection flexibility is provided, but device complexity increases and space is consumed

Engineering Contradiction:

Improveconnection flexibilityVSAvoidassembly complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent integrates the connection between photonics integrated circuit (PIC) and electronic integrated circuit (EIC) directly onto the flexible PCB, eliminating the need for separate cable assemblies. This merging of functions reduces device complexity and space consumption while maintaining connection flexibility through the flexible PCB's inherent properties.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If long conductive traces are used in gold box configuration, then connection between components is achieved, but signal integrity deteriorates and crosstalk increases

Engineering Contradiction:

Improveconnection easeVSAvoidsignal integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts the PIC and EIC from the traditional gold box configuration and mounts them directly on the flexible PCB. This eliminates long conductive traces and associated via holes, thereby improving signal integrity and reducing crosstalk while maintaining manufacturing ease through direct mounting.

Inventive Principle:

Principle #2Taking out (Extraction)

4Stability of the object's composition

If ultra-low CTE materials and ceramic carriers are used, then thermal expansion management is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvethermal stabilityVSAvoidmanufacturing ease

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The patent changes the material parameters of the PCB to ultra-low coefficient of thermal expansion (CTE) materials that match the thermal expansion characteristics of silicon photonics components. This parameter change improves thermal stability and reduces stress on components during temperature variations, while the flexible PCB structure simplifies the overall manufacturing process compared to traditional rigid ceramic carriers.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces stress on sensitive components, improves signal and power integrity, minimizes crosstalk, and extends LiDAR range by enhancing alignment and reducing system costs through efficient packaging.

Implementation Method 1

A flex or rigid-flex PCB can be used to attach a PIC to a LiDAR host board in a manner to reduce stress on the optical and electrical components

Methodology Applied

Scientific EffectFlexibility: Elasticity

Implementation Method 2

using flex or rigid-flex PCBs to reduce stress and alignment issues, and eliminate separate cable assemblies, while incorporating ultra-low CTE materials and embedded ceramic carriers to manage thermal expansion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12495487B2Flex-PCB integrated packaging for silicon photonics LiDAR

Publication Date: 2025.12.09 INTEL CORP

AI summary

Various embodiments disclosed relate to LiDAR systems. The present disclosure includes a method and assemblies for connection photonics modules to LiDAR systems. In an example, a connection assembly can include a system board, a flex printed circuit board (PCB) connected to the system board through an interface, a photonics integrated circuit die mounted on a first side of the flex PCB and an electronic integrated circuit die mounted on a second side of the flex PCB, opposite the first side.