Flex-Rigid Wiring Board Length Extension via Cut Folding

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Solution Overview

Problem

Existing flex-rigid wiring boards face challenges in efficiently extending their length while maintaining electrical connectivity and structural integrity, particularly when subjected to stress or impact, due to limitations in flexible wiring board design and manufacturing methods.

Innovation Solution

A flex-rigid wiring board is created by integrating a flexible wiring board with a rigid wiring board, where the flexible board is extended in length by forming cuts and folding portions, and electrically connected to the rigid board using conductive layers and insulation layers, with shielding layers removed from folding sections to enhance bendability and stress distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the flexible wiring board is extended by making cuts and folding portions, then the length of the flexible wiring board is increased, but the structural integrity and electrical connectivity may be compromised under stress or impact

Engineering Contradiction:
Improvelength of flexible wiring boardVSAvoidelectrical connectivity and structural integrity
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The flexible wiring board is divided into multiple sections by creating cut portions that do not completely sever the board. These cut portions create folding sections that allow the board to be extended while maintaining continuity of the conductive layers through the folds, thus segmenting the structure to achieve extension while preserving electrical connectivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies beforehand cushioning by designing the folding portions with specific geometries and by providing insulation layers and protective structures at the fold locations. These features are built in advance to cushion and distribute stress during folding and under impact conditions, preventing damage to the conductive layers and maintaining structural integrity during extension operations.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Ease of operation

If shielding layers are removed from folding sections to enhance bendability, then the ease of folding is improved, but electromagnetic shielding may be compromised

Engineering Contradiction:
Improvebendability at folding sectionsVSAvoidelectromagnetic interference
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by selectively removing shielding layers only at specific folding sections where bendability is required, while maintaining shielding layers in other areas of the flexible wiring board. This localized modification allows the folding sections to be more compliant and easier to bend, while the remaining shielding layers continue to provide electromagnetic interference protection for the conductive traces.

Inventive Principle:
Principle #3Local quality

3Productivity

If the flexible wiring board is extended by folding, then the production efficiency and material utilization are improved, but the manufacturing complexity increases

Engineering Contradiction:
Improveproduction efficiency and material utilizationVSAvoidmanufacturing process complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-forming the cut portions and folding sections during the manufacturing process, before the final assembly and use of the flexible wiring board. The conductive layers are patterned and the cuts are made in advance, allowing the folding geometry to be precisely controlled during manufacturing. This preliminary formation of folding structures simplifies the overall manufacturing process compared to attempting to create folds after assembly, thereby improving productivity while managing manufacturing complexity.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8677612B2Method for manufacturing flex-rigid wiring board
Publication Date: 2014.03.25 IBIDEN CO LTD
  • US8677612B2 patent drawing
  • US8677612B2 patent drawing
  • US8677612B2 patent drawing

AI summary

A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.