Flex-Rigid PCB Sensor Array for Multi-Modal Robotic Grippers
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Solution Overview
Problem
Conventional robotic systems lack rich sensory feedback, relying on single-modality sensors that are insufficient for complex assembly tasks and cannot provide the necessary data for human-like target object recognition and manipulation, leading to potential damage during grasping and assembly operations.
Innovation Solution
A flex-rigid sensor apparatus is developed, featuring a two-part rigid/flex PCB base structure with pressure sensors sandwiched between layers, providing multi-modal tactile perception capabilities by collecting data from multiple sensor planes and allowing for enhanced object recognition and manipulation control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If single-modality sensors are used in robotic systems, then device complexity is reduced, but measurement precision and information richness are insufficient for complex assembly tasks
Solution Approach 1:
The patent combines multiple sensor modalities (pressure sensors, temperature sensors, vibration sensors) into a single integrated flex-rigid PCB sensor array structure. This merging approach provides rich multi-modal sensory feedback information while maintaining a unified device structure, resolving the contradiction between information richness and device complexity.
Solution Approach 2:
The sensor array structure is designed to perform multiple sensing functions simultaneously - pressure detection, temperature monitoring, and vibration detection - all within a single integrated platform. This multi-functionality enables comprehensive object recognition and manipulation control without requiring separate sensor systems for each modality.
2Measurement precision
If pressure sensors are disposed between rigid and flexible PCB structures, then sensor data collection from multiple planes is enabled, but manufacturing complexity increases
Solution Approach 1:
The sensor array is divided into multiple discrete sensor elements (pressure sensors, temperature sensors, vibration sensors) that are individually positioned between the rigid and flexible PCB layers. This segmentation allows each sensor type to be optimized independently while maintaining the overall integrated structure, improving measurement precision without excessive manufacturing complexity.
Solution Approach 2:
The patent implements a nested structure where the flexible PCB with additional sensors is embedded within or attached to the rigid PCB structure. This nesting approach enables multi-plane sensor data collection while utilizing a hierarchical assembly process that manages manufacturing complexity through staged integration.
3Adaptability or versatility
If out-of-plane circuitry is implemented on flexible PCB, then three-dimensional sensor arrangement is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent extends the circuitry from the planar PCB surface into the third dimension by routing traces off the plane of the flexible PCB. This out-of-plane circuitry enables three-dimensional sensor arrangement and connection, providing greater adaptability for complex sensor geometries while managing manufacturing precision through controlled routing paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flex-rigid sensor apparatus enables robotic systems to achieve human-like target object recognition and manipulation control, reducing the risk of damage during grasping and assembly by providing rich sensory feedback and facilitating immediate corrective actions.
Implementation Method 1
The tactile sensor data is collected by multiple sensors mounted on a novel two-part rigid/flex PCB base structure including a (first) lower rigid printed circuit board (PCB) stack-up structure and an upper (second) flexible PCB stack-up structure
Data Source
AI summary
A flex-rigid sensor apparatus for providing sensor data from sensors disposed on an end-effector/gripper to the control circuit of an arm-type robotic system. The apparatus includes piezo-type pressure sensors sandwiched between lower and upper PCB stack-up structures respectively fabricated using rigid PCB (e.g., FR-4) and flexible PCB (e.g., polyimide) manufacturing processes. Additional (e.g., temperature and proximity) sensors are mounted on the upper/flexible stack-up structure. A spacer structure is disposed between the two stack-up structures and includes an insulating material layer defining openings that accommodate the pressure sensors. Copper film layers are configured to provide Faraday cages around each pressure sensor. The pressure sensors, additional sensors and Faraday cages are connected to sensor data processing and control circuitry (e.g., analog-to-digital converter circuits) by way of signal traces formed in the lower and upper stack-up structures and in the spacer structure. An encapsulation layer is formed on the upper PCB stack-up structure.