Flexible 3D Electronic Device via Electrochemical Vias

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Solution Overview

Problem

Conventional three-dimensional electronic devices face thermal, chemical, and mechanical reliability issues due to high temperatures required for forming vias through silicon substrates, and they are limited by the use of rigid substrates that cannot conform to non-planar surfaces.

Innovation Solution

A flexible three-dimensional electronic device is created using flexible substrates with a polymer layer and electrically conductive vias formed through electrochemical deposition, allowing for lower temperature processing and mechanical flexibility, enabling the device to conform to various shapes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional high temperature via formation is used through silicon substrates, then electrical connectivity between components is achieved, but thermal, chemical and mechanical reliability of bonding deteriorates

Engineering Contradiction:

Improvebonding reliabilityVSAvoidvia formation temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent changes the temperature parameter from conventional high temperature (incompatible with bonding agents) to low temperature (compatible with bonding agents). This is achieved by using electrochemical deposition instead of conventional high temperature via formation methods, allowing via formation at temperatures that preserve bonding agent integrity and improve bonding reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal/mechanical via formation process with an electrochemical deposition process. Instead of using high temperature and mechanical drilling methods that damage bonding, electrochemical deposition enables via formation through controlled electrochemical reactions, eliminating the harmful thermal and mechanical effects on bonding interfaces

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Adaptability or versatility

If rigid substrates are used to carry electronic components, then structural stability is maintained, but adaptability to non-planar surfaces is lost

Engineering Contradiction:

Improveconformability to surfacesVSAvoidsubstrate rigidity

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent replaces rigid substrates with flexible substrates that can conform to non-planar surfaces. The flexible substrates maintain sufficient structural stability to carry electronic components while gaining the adaptability to conform to curved and irregular surfaces, expanding application versatility

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs composite structures combining flexible substrates with bonding agents and conductive materials. This composite approach maintains structural stability through the integrated layers while the flexible substrate base provides conformability to various surface geometries

Inventive Principle:

Principle #40Composite materials

3Productivity

If subsequent electronic components are formed on top of existing stack, then device integration is achieved, but thermal damage to existing components occurs

Engineering Contradiction:

Improveintegration efficiencyVSAvoidthermal damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent performs via formation and component stacking in a sequence that avoids thermal damage. By using low temperature electrochemical deposition for via formation before or during the stacking process, the method prepares the electrical connection paths in advance without exposing existing components to damaging high temperatures

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces high temperature thermal processes with low temperature electrochemical processes for via formation. This substitution eliminates the thermal damage hazard while maintaining integration efficiency, allowing subsequent components to be formed and stacked without compromising existing components

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a flexible three-dimensional electronic device with improved mechanical reliability and the ability to conform to non-planar surfaces, addressing thermal and chemical stability concerns while maintaining electrical connectivity between components.

Implementation Method 1

An electrically conductive via passing through the polymer layer and electrically connecting the first and second electronic components is formed using electrochemical deposition

Methodology Applied

Scientific EffectElectrochemical deposition: Electrodeposition

Data Source

PatentUS11545436B2Flexible three-dimensional electronic device

Publication Date: 2023.01.03 KING ABDULLAH UNIV OF SCI & TECH

AI summary

A flexible three-dimensional electronic device includes a polymer layer having a first side and a second side that is opposite of the first side. A first flexible substrate carrying a first electronic component is arranged on the first side of the polymer layer. A second flexible substrate carries a second electronic component. The second flexible substrate is a flexible silicon substrate arranged on the second side of the polymer layer. An electrically conductive via passes through the polymer layer to electrically connect the first and second electronic components.