Flexible 3D Power Plane Layout for Dense Server Boards
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current power delivery methods in high-performance computing and server systems face challenges such as reduced area for signal routing, increased complexity, mechanical interference, and airflow obstruction due to multiple power layers, cables, and inflexible bus bars.
Innovation Solution
A flexible power plane system using ribbon cables and modular power bosses and clips that distribute power horizontally and vertically, reducing the need for multiple power layers on the circuit board and minimizing mechanical and airflow interference, while allowing for increased signal density and reduced system complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If more power layers are added on a circuit board to meet high power delivery demand, then power delivery capability is improved, but the area available for signal routing is reduced and board complexity increases
Solution Approach 1:
The patent transitions power delivery from a 2D planar approach (multiple power layers on circuit board) to a 3D vertical approach (power bus bars extending vertically from motherboard to circuit boards). This dimensional change allows high power delivery without consuming additional horizontal area on the circuit board, thereby preserving signal routing space and reducing board complexity.
2Power
If power cables are used to deliver power, then power delivery capability is improved, but system complexity regarding cable routing and management increases, chassis space is taken, and airflow is blocked
Solution Approach 1:
The patent extracts the power delivery function from flexible cables and implements it through rigid power bus bars integrated into the motherboard structure. This extraction eliminates the need for separate cable routing and management systems, reducing overall system complexity while maintaining power delivery capability.
Solution Approach 2:
The patent merges the power delivery function with the existing motherboard structure by integrating power bus bars directly into the motherboard. This consolidation eliminates separate cable assemblies and their associated routing complexity, while the rigid bus bar structure does not obstruct airflow like flexible cables would.
3Power
If power bus bars are used to deliver power, then power delivery capability is improved, but mechanical interference occurs due to space above motherboard being occupied
Solution Approach 1:
The patent applies local quality by designing power bus bars with specific geometric characteristics (flat profile, optimized thickness) that minimize their vertical footprint above the motherboard. This localized optimization allows power delivery while reducing mechanical interference with components positioned above the motherboard.
Data Source
AI summary
Technologies for a flexible three-dimensional power plane in a chassis are disclosed. In one embodiment, a flexible ribbon cable is laid along a circuit board tray. The flexible ribbon cable is secured to the tray using power bosses. The power bosses connect to one or more conductors on the ribbon cable. When the circuit board is mounted on the circuit board tray, the power bosses extend through holes in the circuit board and mate with power clips on the surface of the circuit board tray. The ribbon cable, power bosses, and power clips can distribute power to various locations on the circuit board, without requiring large traces that take up space on the circuit board.