Flexible Structure Alignment for Sub-10 nm Precision
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Solution Overview
Problem
Current alignment techniques in semiconductor manufacturing and other fields face challenges in achieving positional accuracy better than 10 nm due to the diffraction limit of optical methods, leading to time-consuming processes and complexity in achieving high precision alignment.
Innovation Solution
A method and apparatus utilizing flexible structures with detectors that measure deflection at surface relief markings, allowing for rapid alignment by detecting deflection of a cantilever tip touching the surface, using optical, piezoresistive, piezoelectric, capacitive, inductive, or surface acoustic wave detection systems to generate precise alignment signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical alignment techniques are used, then alignment can be achieved with reasonable speed, but positional accuracy is limited to about 100 nm due to the diffraction limit
Solution Approach 1:
The patent replaces optical alignment techniques with a mechanical scanning probe system. A physical probe tip scans the surface of the substrate to detect alignment marks, substituting the optical measurement system with a mechanical contact-based system that can achieve sub-10 nm resolution without being constrained by the diffraction limit of light.
Solution Approach 2:
The patent introduces a scanning probe as an intermediary element between the alignment system and the substrate. The probe tip physically interacts with the alignment marks on the substrate surface, converting positional information into detectable signals that enable high-precision alignment measurement beyond optical capabilities.
2Measurement precision
If optical alignment techniques are used, then alignment can be performed, but achieving accuracy better than 10 nm becomes extremely difficult due to the diffraction limit
Solution Approach 1:
The patent replaces optical alignment techniques with a mechanical scanning probe system. A physical probe tip scans the surface of the substrate to detect alignment marks, substituting the optical measurement system with a mechanical contact-based system that can achieve sub-10 nm resolution without being constrained by the diffraction limit of light.
3Productivity
If higher alignment accuracy of better than 10 nm is achieved, then production processes can be sped up, but the technical complexity and difficulty increase significantly
Solution Approach 1:
The patent replaces optical alignment techniques with a mechanical scanning probe system. A physical probe tip scans the surface of the substrate to detect alignment marks, substituting the optical measurement system with a mechanical contact-based system that can achieve sub-10 nm resolution without being constrained by the diffraction limit of light.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces alignment time and improves precision, enabling alignment accuracy better than 10 nm with increased speed and efficiency in semiconductor and other nano-scale manufacturing processes.
Implementation Method 1
providing a detector for measuring an interaction of the flexible structure with the surface relief marking and generating detector signals relating to the interaction; wherein said detector detects deflection of said flexible structure by a tip of the flexible structure touching the surface
Data Source
AI summary
A method and apparatus is described for aligning a first article relative to a second article, for example for aligning a nanoimprint template with a semiconductor wafer. The method comprises the steps of: providing said second article with at least one flexible structure fixed relative thereto at least one point, providing a first article having at least one surface relief marking thereon, providing a detector for measuring an interaction of the flexible structure with the surface relief marking and generating detector signals relating to said interaction, identifying with the help of the detector signals the position of the flexible structure and thus of the second article with respect to the surface relief marking and generating relative movement between the first and second articles to achieve a desired alignment between the first and second articles defined by the surface relief marking. In this method and apparatus the flexible structure is brought into contact with the surface relief marking.