Flexible Antenna Array Interconnect for 60 GHz Wireless Devices
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Solution Overview
Problem
Current wireless networks face bandwidth limitations in commonly used frequency bands, particularly with the growing demand for high-bandwidth multimedia applications, making the 60 GHz band a valuable alternative for wireless communication.
Innovation Solution
The use of phased array antennas mounted on flexible substrates with flexible interconnects allows for the efficient transmission and reception of RF signals in the 60 GHz band, enabling flexible antenna placement and reduced electromagnetic interference, while multiple antenna arrays can be strategically positioned on device housings to enhance signal alignment and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antenna arrays are mounted on flexible substrates with flexible interconnects, then bandwidth and flexibility in device arrangement are improved, but device complexity increases
Solution Approach 1:
The antenna system is divided into multiple antenna arrays, each mounted on separate flexible substrates with independent flexible interconnects. This segmentation allows each array to be independently positioned and configured on device housings, providing flexibility in arrangement while keeping individual array complexity manageable.
Solution Approach 2:
The patent transitions from planar PCB-mounted antennas to three-dimensional positioning on device housings using flexible substrates. This dimensional change enables antenna arrays to be placed on multiple surfaces and orientations of the device housing, significantly increasing arrangement flexibility beyond what traditional flat circuit boards allow.
2Reliability
If multiple antenna arrays are strategically positioned on device housings, then signal alignment and quality are improved, but manufacturing precision requirements increase
Solution Approach 1:
The flexible substrates enable the antenna arrays to be dynamically positioned at optimal locations on device housings. During manufacturing, the flexible interconnects allow arrays to be placed and secured at precise positions that maximize signal alignment, while the flexibility accommodates minor positioning variations without compromising performance.
Solution Approach 2:
The patent changes the physical state of the substrate from rigid to flexible, which fundamentally alters how positioning is achieved. The flexible substrate can be conformally attached to various surfaces of the device housing and maintains electrical connectivity through the flexible interconnect, reducing the precision requirements compared to rigid PCB mounting while still achieving optimal signal alignment.
3Productivity
If phased array antennas are used for 60 GHz band communication, then bandwidth is improved, but electromagnetic interference increases
Solution Approach 1:
The patent extracts the antenna arrays from the main device body and positions them on external device housings using flexible interconnects. This separation removes the high-frequency 60 GHz antenna elements away from sensitive internal circuitry, reducing electromagnetic interference while maintaining the high bandwidth capability of phased array operation in the 60 GHz band.
Data Source
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AI summary
An antenna array can be mounted on a flexible substrate and connected by a flexible interconnect to an integrated circuit such as a radio frequency front end. The antenna array can be mounted in a device housing that includes radio frequency interference (RFI) shielding. The antenna array is aligned with and next to an area of the housing that is not shielded against RFI.