Flexible Array Substrate Bonding Pad Orientation
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Solution Overview
Problem
Flexible array substrates made of materials like PI or PET often deform during the formation of via holes by etching, leading to inaccurate alignment and misplacement of bonding pads on the chip on film and array substrate, resulting in poor bonding or short-circuits due to expansion or shrinkage.
Innovation Solution
The array substrate and chip on film are designed with annularly arranged bonding pads whose length directions face the display area, ensuring they remain bonded even during deformation, such as outward expansion or inward shrinkage, through a one-to-one correspondence arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible array substrates are used, then adaptability and flexibility are improved, but manufacturing precision deteriorates due to deformation during etching
Solution Approach 1:
The patent applies preliminary action by pre-establishing the bonding pad arrangement pattern on the array substrate before the deformation occurs during etching. The bonding pads are designed with specific length directions facing the display area and arranged in a pattern that anticipates the deformation, ensuring that even after the substrate deforms during via hole etching, the bonding pads maintain accurate alignment with their corresponding pads on the chip on film.
2Ease of manufacture
If bonding pads are arranged conventionally, then ease of manufacture is improved, but reliability deteriorates due to misalignment during deformation
Solution Approach 1:
The patent applies local quality by making the bonding pads have different orientations and arrangements in different local regions. Specifically, the bonding pads are designed with their length directions facing the display area, creating a localized quality that ensures accurate alignment at the bonding interface. This localized optimization of bonding pad orientation and arrangement ensures reliable bonding at the critical bonding area while maintaining ease of manufacture overall.
Data Source
AI summary
Provided are an array substrate, a chip on film, a display panel and a display device. The array substrate has a display area and a bonding area located in a periphery of the display area. The array substrate includes a plurality of first bonding pads located in the bonding area, and length directions of the first bonding pads face the display area.