Flexible Array Substrate with Edge-Abutting Bonding for Frameless Displays
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Solution Overview
Problem
Existing flexible display devices face challenges in minimizing the non-display area and reducing the number of layers in their substrates, which affects their thickness, manufacturing complexity, and cost, while also requiring a frame along multiple edges, limiting their design flexibility.
Innovation Solution
A flexible array substrate design featuring a flexible display portion with intersecting signal lines and a flexible circuit bonding portion abutting only one edge, allowing for a frameless display panel with optimized electrical wiring and reduced non-display area, achieved by using parallel data and gate lines in separate layers with an insulating layer in between, and incorporating a gate-driver on array (GOA) circuit for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a flexible display device uses a conventional substrate structure with frames along multiple edges, then structural stability is improved, but the non-display area increases and design flexibility is reduced
Solution Approach 1:
The patent removes the frame structure from three edges of the flexible display device, extracting only the necessary support elements and retaining minimal framing. This extraction principle reduces the non-display area while maintaining adequate structural stability through the remaining frame and flexible substrate design.
Solution Approach 2:
The patent employs a flexible substrate made of thin film materials that provide structural support without requiring rigid frames along all edges. The flexible shell structure maintains stability through its material properties and geometric design rather than extensive framing, thereby reducing the non-display area.
2Manufacturing precision
If a flexible display device increases the number of layers in the substrate, then manufacturing precision and signal transmission are improved, but the device thickness and manufacturing complexity increase
Solution Approach 1:
The patent combines multiple functional layers into an integrated substrate structure where signal transmission functions are achieved through optimized routing of data and gate lines within fewer distinct layers. The merging of functions reduces the total number of layers while maintaining manufacturing precision through careful design of the integrated structure.
Solution Approach 2:
The patent resolves layer complexity by transitioning to a flexible substrate architecture where signal transmission is achieved through three-dimensional routing and stacking approaches rather than increasing the number of planar layers. This dimensional reorganization maintains signal quality while reducing overall device thickness and manufacturing complexity.
Data Source
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AI summary
A flexible array substrate is disclosed. The flexible array substrate comprises a flexible display portion comprising a plurality of first signal lines and a plurality of second signal lines intersecting each other; a flexible circuit bonding portion abutting the flexible display portion for bonding circuit parts; and a plurality of first connection lines for transmitting first signals to the plurality of first signal lines. Each of the plurality of first connection lines connects with a corresponding first signal line, and extends from the flexible display portion to the flexible circuit bonding portion. Each of the plurality of first connecting lines crosses over at least one other first signal line within the flexible display portion.