Flexible Array Substrate with Organic Island Portions for Bending Reliability
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Solution Overview
Problem
Existing flexible OLED display panels face issues with film layers peeling off and metal traces cracking due to complex etching processes and permeation of moisture and oxygen, especially in the bending regions where inorganic insulating layers are etched.
Innovation Solution
The solution involves a flexible substrate with a flat portion and island portions formed by exposure and development of organic materials, eliminating the need for etching inorganic layers, which reduces process complexity and enhances moisture and oxygen blocking, integrating the island portions with the base layer for stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two etching processes are used to form the first inversed island portion and the second inversed island portion, then the bending region is formed, but the manufacturing process becomes complicated and tedious
Solution Approach 1:
The patent extracts and removes the inorganic insulating layers (gate insulating layer and first insulating interlayer) from the bending region through selective removal processes. This extraction eliminates the need for complex multi-step etching of inorganic layers, simplifying the manufacturing process while still forming the necessary bending regions (first and second inversed island portions) for flexible display panel bending
Solution Approach 2:
Instead of etching the inorganic insulating layers to form the bending regions (conventional approach), the patent inverts the approach by removing these layers selectively and forming the bending regions through the underlying organic substrate structure. This inversion simplifies the process by avoiding complex inorganic layer etching while achieving the same functional result
2Reliability
If inorganic insulating layers are etched to form the first inversed island portion and the second inversed island portion, then the bending region is created, but moisture and oxygen easily permeate into the device via interfaces between film layers
Solution Approach 1:
The patent removes the inorganic insulating layers (gate insulating layer and first insulating interlayer) from the bending region entirely rather than etching them. This extraction eliminates the created interfaces between film layers that would otherwise serve as pathways for moisture and oxygen permeation, while still maintaining the bending region functionality through the organic substrate structure
Solution Approach 2:
The patent converts the potential harm of having removed inorganic layers (which could create permeation pathways) into a benefit by using the underlying organic substrate and remaining layer structure to form the bending regions. This approach eliminates the interface permeation problem while maintaining the necessary mechanical flexibility for bending
3Adaptability or versatility
If the first inversed island portion and the second inversed island portion are bent, then flexibility is achieved, but the film layers easily peel off from the cross section of film layers
Solution Approach 1:
The patent removes the inorganic insulating layers from the bending region, eliminating the rigid structures that would prevent flexible bending. This extraction allows the remaining organic-based structure to flex without the constraint of brittle inorganic layers, achieving the required flexibility while maintaining film layer integrity through the organic substrate's inherent flexibility
Solution Approach 2:
The patent employs the organic substrate and organic-based insulating layers as flexible structures that can accommodate bending without peeling. The organic material's inherent flexibility and adhesion properties allow the film layers to maintain stability during bending operations, preventing delamination at the cross-section interfaces
4Adaptability or versatility
If the first inversed island portion and the second inversed island portion are bent, then flexibility is achieved, but the metal layers (source drain traces) easily crack
Solution Approach 1:
The patent removes the inorganic insulating layers that would otherwise create rigid constraints on the metal layers during bending. By extracting these rigid structures, the metal layers are allowed to flex with the organic substrate without experiencing the stress concentrations that would cause cracking, thereby maintaining both flexibility and metal layer integrity
Solution Approach 2:
The patent uses the organic substrate and organic-based insulating layers as flexible supporting structures that accommodate metal layer bending. The organic material's flexibility allows the metal traces to bend without exceeding their elastic limit, preventing crack formation while maintaining the required flexibility for display panel bending
Data Source
AI summary
An array substrate, a manufacturing method thereof and a display panel are provided. The display panel includes a flexible substrate having a flat portion, a first island portion and a second island portion. The first island portion and the second island portion extend and are protruded from the flat portion and are space apart from each other. A semiconductor device is disposed on the flat portion of the flexible substrate. An organic electroluminescent device is disposed on the semiconductor device. The present application solves the problem of film layers easily to be peeled off and traces easily to be broken for bent flexible display panels in existing arts.