Flexible Array Substrate Through-Hole Design
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Solution Overview
Problem
Current flexible display panels experience faults in the source/drain due to increased film segment differences caused by the use of organic material layers, leading to issues with data signal transmission.
Innovation Solution
An array substrate design with a specific layer structure and through-hole configuration, where the diameter of the second through-hole is greater than the third and fourth through-holes, and the distance between the second and first through-holes is increased, reducing the risk of faults by ensuring sufficient metal deposition and reducing segment differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an organic material layer is used to improve flexibility and bending performance, then the bending performance is improved, but the film segment difference increases causing source/drain faults
Solution Approach 1:
The patent removes the organic material layer from the structure and replaces it with an inorganic film layer configuration. Specifically, the solution involves forming a first inorganic film layer with through-holes that are filled with a filling material, eliminating the need for organic materials while maintaining flexibility and preventing source/drain faults caused by film segment differences.
Solution Approach 2:
The patent changes the material parameters from organic to inorganic films. The first inorganic film layer is formed with specific properties (different from the second inorganic film layer) to achieve both flexibility and reliability. The through-hole filling material parameters are also optimized to ensure proper stress distribution and prevent faults.
2Reliability
If the diameter of through-holes is increased to ensure metal deposition continuity, then source/drain fault risk is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent applies different diameters to different through-holes based on their specific locations and functions. The first through-holes (for source/drain connections) have larger diameters to ensure metal deposition continuity, while other through-holes may have different sizes. This localized optimization ensures reliability without uniformly increasing complexity across the entire structure.
Solution Approach 2:
The patent performs preliminary filling of through-holes with filling material before forming the metal layers. This preliminary action ensures that the through-holes are properly prepared and stabilized, allowing for successful metal deposition without requiring excessive oversizing of the holes, thus balancing reliability with manufacturing simplicity.
3Reliability
If the distance between through-holes is increased to reduce stress concentration, then bending reliability is improved, but device area increases
Solution Approach 1:
The patent optimizes the distance parameter between through-holes based on stress distribution analysis. By carefully selecting the spacing between the first through-holes and second through-holes, the design achieves sufficient stress relief for bending reliability while minimizing the overall device area. The specific distance is determined by the mechanical properties of the inorganic film layers and the filling material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of faults in the source/drain by ensuring continuous metal connectivity from the top to the bottom of the through-holes, improving the bending performance and reliability of flexible display panels.
Implementation Method 1
due to filling of the first through-hole, the transparent filling layer near the first through-hole is uneven, which causes faults in a subsequent manufacturing process of source/drain
Data Source
AI summary
The present disclosure provides an array substrate and a flexible display panel. A source/drain of the array substrate is connected to an active terminal of an active layer through a second through-hole, and is connected to a first metal terminal of a first metal layer through a third through-hole, and is connected to a second metal terminal of a second metal layer through a fourth through-hole. A distance between the second through-hole and the first through-hole is greater than a predetermined distance, which reduces the impact of film segment difference and relieve the problem of faults in source/drain in the current flexible display panels.