Flexible Backlight Module Using White Quantum Dot Layer

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Solution Overview

Problem

Traditional side-lighting type backlight modules are not suitable for flexible display panels due to the large size of LED chips and limitations in optical properties, making it difficult to develop thin and light display panel structures.

Innovation Solution

A backlight module design featuring a soft flexible substrate with a reflective layer, a white quantum dot light emitting layer, an electrode layer, and multiple diffusion layers, along with an adhesive material layer, which uses electroluminescence to emit light and is patterned using semiconductor processes, allowing for a thin and flexible structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional side-lighting type backlight module uses large LED chips integrated on IC board, then lighting function is achieved, but the module becomes too thick and rigid for flexible display panels

Engineering Contradiction:

Improveflexibility for display panelVSAvoidthickness of backlight module

Core Design Contradiction:

Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The patent replaces the traditional mechanical assembly of LED chips mounted on rigid IC boards with a printed circuit board (PCB) structure where conductive patterns are directly formed on a flexible substrate. This substitution of mechanical mounting with printed conductive pathways enables the backlight module to achieve flexibility while maintaining electrical connectivity, allowing adaptation to flexible display panels.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs a flexible PCB substrate as the base for the backlight module, replacing rigid printed circuit boards. This flexible substrate allows the entire backlight assembly to bend and conform to flexible display panels, directly addressing the need for adaptability while reducing overall thickness compared to traditional rigid LED backlight constructions.

Inventive Principle:

Principle #30Flexible shells and thin films

2Productivity

If traditional backlight components are assembled by manpower with manual processes, then assembly is achievable, but production efficiency is low and manpower costs are high

Engineering Contradiction:

Improveproduction efficiencyVSAvoidmanual assembly complexity

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The patent integrates multiple components (conductive patterns, optical elements, and structural layers) into a single printed circuit board assembly. By combining these previously separate manually assembled components into one integrated PCB structure, the manufacturing process can be automated using standard PCB fabrication techniques, significantly improving production efficiency and reducing manpower requirements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from manual assembly processes to automated PCB manufacturing processes by changing the fabrication parameters and methods. Instead of hand-placing components, the conductive patterns and component integrations are achieved through automated printing and lamination processes, enabling high-volume production with consistent quality and reduced labor costs.

Inventive Principle:

Principle #35Parameter changes

3Length of stationary object

If optical components are assembled manually with traditional methods, then assembly is possible, but the optical properties are limited and thinning is difficult

Engineering Contradiction:

Improvethickness of display panelVSAvoidoptical properties

Core Design Contradiction:

Length of stationary objectVSReliability

Solution Approach 1:

The patent integrates optical functions directly into the PCB plane rather than stacking multiple separate optical components in the vertical dimension. By incorporating diffusing agents, reflecting surfaces, and light guiding features within the PCB layers themselves, the design achieves thinning while maintaining optical performance through in-plane optical management rather than vertical component stacking.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the thickness of the backlight module, saves manpower costs, and improves production efficiency by enabling a lightweight and thin display panel structure suitable for flexible displays.

Implementation Method 1

the white quantum dot light emitting layer emits light by using an electroluminescence of the quantum dot

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

the reflective layer is adhered on the outer surface of the soft flexible substrate for upward reflecting the light emitted from the bottom surface of the white quantum dot light emitting layer

Methodology Applied

Scientific EffectLight reflection: Reflection

Data Source

PatentUS10788705B2Backlight module and manufacturing method thereof

Publication Date: 2020.09.29 HKC CORP LTD

AI summary

The present invention relates to a backlight module and manufacturing method thereof. The backlight module comprises: a soft substrate having an outer surface and a flexible substrate; a reflective layer disposed on the outer surface of the soft substrate; a white quantum dot light emitting layer disposed on the soft substrate; an electrode layer disposed on the white quantum dot light emitting layer and covering the soft substrate.