Flexible to Base Connector with Concentric Solder Bump Alignment

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Solution Overview

Problem

Existing connectors for flexible printed circuit boards face challenges in secure and efficient alignment and locking mechanisms, particularly in integrating flexible connectors with rigid printed circuit boards, which often result in unreliable electrical connections.

Innovation Solution

A flexible connector with solder bumps arranged in a first pattern is aligned with a base connector having solder bumps in a second pattern of different size, allowing for concentric alignment and secure locking through a compression mechanism using a central screw, facilitating reliable electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional alignment mechanisms are used for flexible connectors, then alignment process is simple, but alignment precision is insufficient leading to unreliable electrical connections

Engineering Contradiction:
Improvealignment precisionVSAvoidconnector structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The solder bumps on both the flexible connector and base connector are designed to self-align through their concentric circular patterns. When the flexible connector is compressed onto the base connector, the solder bumps automatically align along the radial direction without requiring external alignment mechanisms, achieving precise alignment through the inherent geometry of the components themselves

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The solder bumps are pre-positioned in concentric circular patterns on both connectors before assembly. This preliminary arrangement ensures that when compression is applied, the alignment is already predetermined by the geometric configuration, eliminating the need for complex real-time alignment mechanisms during the assembly process

Inventive Principle:
Principle #10Preliminary action

2Reliability

If compression mechanism is added for secure locking, then connection reliability is improved, but device complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidlocking mechanism complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The compression mechanism is designed to work in conjunction with the self-aligning solder bumps. As compression force is applied, the flexible connector naturally compresses and locks onto the base connector through the predefined concentric circular geometry of the solder bumps, achieving secure locking through the inherent elastic deformation of the flexible material rather than complex mechanical locking structures

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The flexible connector utilizes changes in its physical state under compression - transitioning from a relaxed state to a compressed state where elastic deformation occurs. This parameter change in the flexible material's shape and density enables the locking function, replacing the need for complex mechanical locking mechanisms with a simple compression-based solution

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11387583B2Flexible to base connector
Publication Date: 2022.07.12 SEAGATE TECH LLC
  • US11387583B2 patent drawing
  • US11387583B2 patent drawing
  • US11387583B2 patent drawing

AI summary

A connector includes a flexible connector having a first plurality of solder bumps arranged in a first pattern, and a base connector having a second plurality of solder bumps arranged in a second pattern concentric with and of a different size than the first pattern. A method of interconnecting a flexible connector to a base connector includes providing the flexible connector with a first plurality of solder bumps arranged in a first pattern, and providing the base connector with a second plurality of solder bumps arranged in a second pattern. The flexible and base connectors are aligned by aligning the first and second pluralities of solder bumps.