Flexible Printed Board Regions for Endoscope Imaging Module Noise Reduction
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Solution Overview
Problem
Conventional endoscope imaging modules become larger with increased pixel count due to mounting electronic components and signal cables, leading to challenges in miniaturization and moisture resistance.
Innovation Solution
The imaging module incorporates a CMOS image sensor with a first chip for light reception and a second chip for signal amplification, connected via a flexible printed board (FPC) with regions divided by bending to separate drive and image signal cables, enhancing signal transmission speed and reducing noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of pixels in the image sensor is increased, then the imaging capability is improved, but the imaging unit becomes larger due to increased electronic components and signal cables
Solution Approach 1:
The imaging unit is divided into multiple regions on the FPC board, with different functional components (image signal cable connection, drive signal cable connection, electronic components) separated into distinct areas. This segmentation allows for optimized signal routing and reduced interference while maintaining high pixel count capabilities.
Solution Approach 2:
The FPC board is bent to create a three-dimensional configuration that separates signal paths in the spatial dimension. By bending the FPC, the image signal cable and drive signal cable are positioned in different spatial regions, reducing electromagnetic interference while accommodating increased pixel density.
2Area of stationary object
If the imaging unit is miniaturized by bending the FPC board, then the size is reduced, but signal transmission quality may deteriorate due to increased cable complexity
Solution Approach 1:
The FPC board is divided into multiple regions with dedicated areas for image signal cables and drive signal cables. This regional separation maintains signal integrity by preventing interference even when the overall unit is miniaturized through bending.
Solution Approach 2:
Different regions of the FPC board are optimized for different signal types. The bending creates local spatial separation where image signal cables and drive signal cables occupy different zones, ensuring each signal type maintains its transmission quality despite the compact overall size.
3Area of stationary object
If signal cables are densely packed to reduce size, then miniaturization is achieved, but noise interference increases between image signal and drive signal
Solution Approach 1:
The FPC board is segmented into distinct regions for image signal cables and drive signal cables. This segmentation creates physical separation between potentially interfering signals, reducing noise while maintaining a compact overall footprint.
Solution Approach 2:
The FPC is bent to separate signal cables in the spatial dimension rather than merely packing them closely in two dimensions. This three-dimensional arrangement reduces electromagnetic interference between image and drive signals while achieving miniaturization.
Data Source
AI summary
An imaging module includes: a first chip having a light-receiving unit; a flexible printed board connected to an electrode pad of the first chip via an inner lead extended from one end of the flexible printed board; a second chip having a transmission buffer on the flexible printed board; an image signal cable configured to output an image signal; and a drive signal cable configured to input a drive signal. The first and second chips constitute a CMOS imager. The image signal output from the first chip is amplified by the second chip. The flexible printed board includes two or more regions divided by bending the flexible printed board at a bending part arranged parallel to an optical axis direction of the imaging module. The second chip and the drive signal cable are connected to different regions of the flexible printed board.