Flexible Board Overlap Wiring for Stable Liquid Jet Head Drive
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Solution Overview
Problem
Existing liquid jet recording devices face challenges in improving the reliability of liquid jet heads due to issues with drive noise, inductance components, and increased rigidity affecting the flexibility and handling of flexible boards.
Innovation Solution
The flexible board design incorporates a configuration where at least part of the individual wiring region and common wiring region overlap, with the common wiring line positioned near the individual wiring lines, forming an overlap region that suppresses inductance components and maintains flexibility, ensuring a robust return path and ease of assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the common wiring line is arranged separately from the individual wiring lines, then the manufacturing process is simpler, but inductance components increase and drive noise is generated
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional overlapping arrangement where the common wiring line and individual wiring lines occupy the same projected area but different vertical positions. This dimensional change allows the wirings to be closely coupled spatially without increasing planar complexity, thereby reducing inductance and noise while maintaining manufacturing simplicity.
Solution Approach 2:
The patent merges the common wiring line and individual wiring lines into a shared spatial region (overlap region), creating a compact wiring structure. This merging reduces the loop area for current return paths, minimizing inductance components and electromagnetic noise generation while simplifying the overall wiring layout.
2Reliability
If the flexible board is made more rigid to improve structural stability, then the reliability improves, but the flexibility and handling become difficult
Solution Approach 1:
The patent employs a flexible board with a thin-film structure that maintains flexibility for easy handling and assembly. The wiring structure is designed to work within this flexible substrate, with the overlap region providing structural reinforcement without compromising the overall flexibility of the board, thus resolving the contradiction between rigidity and flexibility.
3Object-generated harmful factors
If the wiring structure is optimized to reduce inductance, then the drive noise decreases, but the manufacturing complexity increases
Solution Approach 1:
The patent uses vertical stacking in the overlap region to achieve compact wiring without increasing planar complexity. This three-dimensional arrangement reduces the current loop area and inductance effectively, while the manufacturing process remains relatively simple as it utilizes standard multi-layer flexible board fabrication techniques.
Data Source
AI summary
A flexible board includes a first and second wiring layers opposed to each other along a direction perpendicular to a board surface of the flexible board, at least one drive device arranged on the first wiring layer, an individual wiring region arranged in the first wiring layer, including a plurality of individual wiring lines, a common wiring region arranged in the second wiring layer, including at least one common wiring line, a pressure-bonding electrode part arranged closed to the jet section side than the individual wiring region and the common wiring region, including a plurality of pressure-bonding electrodes electrically coupled individually to the plurality of individual wiring lines and the at least one common wiring line, and an overlap region in which at least a part of the individual wiring region and at least a part of the common wiring region overlap each other in the board surface.