Flexible Circuit Board Through-Substrate Conducting Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flexible circuit boards struggle to efficiently connect circuit layers and soldering structures on two different sides, limiting their application in thin electronic devices.
Innovation Solution
The implementation of grooves and/or thru holes on the flexible substrate, combined with conductive layers or metal bumps, to establish electrical connections between circuit and soldering structures on opposite sides of the flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a circuit layer is arranged on the surface of one side of the flexible circuit board, then the structure is simple and easy to manufacture, but it cannot be used in a structure that requires circuit layer and soldering structure on two different sides
Solution Approach 1:
The patent transitions from a single-sided surface arrangement to a three-dimensional structure by forming grooves on the lateral surface and creating through-holes that penetrate the flexible substrate. This dimensional change enables circuit layers and soldering structures to be positioned on opposite sides while maintaining electrical connection through the substrate thickness, thus achieving dual-sided functionality without excessive complexity
Solution Approach 2:
The electrically connecting structure is nested within the grooves and through-holes formed in the flexible substrate. The conductive layers are positioned inside the hollow spaces created by the grooves, allowing the connection structure to be integrated within the substrate itself rather than adding external complexity
2Adaptability or versatility
If grooves and thru holes are formed on the flexible substrate to enable dual-sided connection, then adaptability is improved, but manufacturing process complexity increases
Solution Approach 1:
The flexible substrate is segmented by forming multiple grooves and through-holes at different positions. Each groove and through-hole serves as an independent channel for electrical connection, allowing the manufacturing process to be divided into discrete steps: forming grooves, creating through-holes, and depositing conductive layers in each segment, thereby simplifying the overall manufacturing complexity
Solution Approach 2:
The patent employs parameter changes in the form of chemical vapor deposition or electroplating processes to transform the physical and chemical properties of the substrate surface. By controlling deposition parameters such as thickness, material composition, and surface treatment, the manufacturing process achieves precise control over conductive layer properties without requiring complex mechanical operations
Data Source
AI summary
An electrically conducting structure for a flexible circuit board, comprising a flexible substrate, a circuit layer, a soldering structure and an electrically connecting structure. The flexible substrate includes a first surface, a second surface, a lateral surface and a plurality of grooves. The first surface is opposite to the second surface, and the lateral surface connects the first surface and the second surface. The grooves are formed on the lateral surface and connect the first surface and the second surface. The circuit layer is formed on the first surface and includes an electrically conducting structure located near the lateral surface. The soldering structure is formed on the second surface. The electrically connecting structure extending form the first surface to the second surface connects the electrically conducting structure and the soldering structure.