Flexible Cable Single-Chip Module for Capacitive Interconnect Alignment
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Solution Overview
Problem
Existing semiconductor chip packaging technologies face challenges in aligning chips accurately due to thermal expansion, mechanical vibrations, and manufacturing perturbations, which affect capacitive inter-chip communication and increase power consumption.
Innovation Solution
The development of single-chip and multi-chip modules with flexible and rigid cable structures, thermal joints, and symmetric layer deposition to enable precise alignment and self-adjustment, allowing for effective capacitive coupling and reduced misalignment, along with flexible power distribution and cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional mounting structures are used to position chips, then assembly is simplified, but misalignment occurs due to thermal expansion, mechanical vibrations, and manufacturing perturbations
Solution Approach 1:
The patent applies parameter changes by making the cable mechanically independent in specific sections, allowing it to accommodate thermal expansion and mechanical vibrations through flexibility compliance greater than a threshold value, while maintaining precise alignment for capacitive coupling
Solution Approach 2:
The patent implements dynamics by designing the cable with sections of differential flexibility - some sections have flexibility compliance greater than a threshold value to absorb thermal and mechanical perturbations, while other sections maintain stiffness to preserve alignment precision
2Manufacturing precision
If chips are rigidly fixed in mounting structures, then alignment is maintained, but thermal expansion and mechanical vibrations cause misalignment
Solution Approach 1:
The patent changes the mechanical parameters of the cable by creating sections with flexibility compliance greater than a threshold value, enabling the cable to dynamically adjust to thermal expansion and mechanical vibrations while maintaining alignment precision
Solution Approach 2:
The cable acts as an intermediary element between the semiconductor die and the mounting structure, absorbing thermal and mechanical perturbations through its flexible sections while transmitting stable electrical connections
3Use of energy by moving object
If alignment tolerance is reduced to improve communication performance, then power consumption decreases, but alignment becomes more difficult to achieve
Solution Approach 1:
The patent changes the flexibility parameter of the cable to create compliance greater than a threshold value, which actively maintains alignment within tight tolerances to enable low-power capacitive coupling communication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and efficient capacitive inter-chip communication with reduced misalignment, increased bandwidth, and improved power management, while also allowing for reworkability and full burn-in testing of semiconductor dies.
Implementation Method 1
A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure
Implementation Method 2
The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die
Implementation Method 3
The first semiconductor die may have substantially symmetric layers deposited on the first surface and the second surface resulting in a substantially 4-fold symmetry that reduces perturbation-induced quadrapole mechanical deviations of the first semiconductor die from a plane parallel to the first surface below a pre-determined value
Implementation Method 4
The single-chip mounting structure may include a pedestal coupled to the second surface of the first semiconductor die via a thermal joint
Data Source
AI summary
A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.