Flexible Cable Temperature Sensor for Aerospace ICs
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Solution Overview
Problem
Existing temperature sensing integrated circuits (ICs) in aerospace engine controllers often provide inaccurate temperature readings due to indirect measurement methods, relying on weak thermal connections, which can lead to slow reaction times and self-heating effects, causing system failures when monitoring critical electronic components.
Innovation Solution
A temperature sensing system with a flexible cable and sensing element that allows direct bonding to the critical component, enabling accurate and real-time temperature monitoring by integrating a signal conditioning unit with a flexible cable connecting the sensing element to the signal conditioning unit, which can be mounted on a circuit board and extend to the component, using a flexible cable that is compatible with various IC package topologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If indirect temperature sensing methods are used with weak thermal connections, then the sensing element can be isolated from the critical component, but the temperature reading accuracy deteriorates and reaction time increases
Solution Approach 1:
The temperature sensing system is divided into two separate functional modules: a sensing element that directly contacts the critical component for accurate temperature detection, and a temperature sensing IC that processes the signal. These modules are connected via a flexible cable, allowing the sensing element to be thermally coupled to the component while the IC remains electrically connected but thermally isolated.
Solution Approach 2:
A flexible cable serves as an intermediary connection between the sensing element and the temperature sensing IC. This cable transmits the temperature signal while minimizing thermal interference, allowing the sensing element to maintain direct contact with the critical component without transferring excessive heat through the connection path.
2Ease of operation
If the sensing element is not directly bonded to the critical component, then the sensing IC can be mounted on the PCB, but the reaction time to temperature changes deteriorates
Solution Approach 1:
The system separates the sensing function from the processing function. The sensing element is directly bonded to the critical component (e.g., processor) to ensure immediate detection of temperature changes, while the temperature sensing IC is mounted on the PCB through the flexible cable connection to maintain ease of operation and circuit board integration.
3Device complexity
If the sensing element is positioned away from the critical component, then the sensing IC can be integrated into the PCB, but self-heating effects and ambient temperature interference increase
Solution Approach 1:
The flexible cable acts as an intermediary that allows the sensing element to be positioned in optimal thermal contact with the critical component while keeping the temperature sensing IC at a distance from heat-generating areas. This intermediary connection enables PCB integration while minimizing the harmful effects of self-heating and ambient temperature interference on the sensing IC.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides accurate and reliable temperature monitoring and control of critical components over a wider temperature range (-55° C to 175° C), preventing system failures by directly measuring the temperature of the component, reducing errors associated with indirect sensing methods.
Implementation Method 1
the sensing element is mountable directly to an exterior surface of the component being sensed... to prevent incorrect temperature readings from adjacent heat sources
Data Source
Figure 1~3
Figure 4
AI summary
A temperature sensing system (100, 300) includes a temperature sensing element (106, 316). The temperature sensing element (106, 316) is bondable to an exterior surface of an electronic component (108, 314) and configured to sense a temperature at an interior of the electronic component (108, 314). The system further includes a flexible cable (104, 304) operatively connected to the temperature sensing element (106, 316), and a signal conditioning unit (102, 308) operatively connected to a distal end of the flexible cable (104, 304). The signal conditioning unit (102, 308) is mountable to a printed circuit board proximate to the electronic component (108, 314). The signal conditioning unit (108, 308) is configured to receive a signal from the temperature sensing element (106, 316), and output a signal indicative of the temperature at the interior of the electronic component.