Flexible Multilayer Camera Module Reducing Height

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Solution Overview

Problem

Conventional camera modules have a high height due to the sequential arrangement of the lens unit, image sensor IC, and rigid multilayer substrate, making it difficult to reduce the module's height and are prone to damage from bending or warping, especially when connected using flexible cables.

Innovation Solution

A camera module with a multilayer base body formed from flexible base material layers, integrated with a lens unit, image sensor IC, and peripheral circuit components, where the image sensor IC is positioned in a cavity and the lens unit is optically coupled through a penetration hole, and a connector element is integrated for external connection, enhancing durability and reducing height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the lens unit, image sensor IC, and rigid multilayer substrate are successively arrayed in the thickness direction, then the camera module structure is simple and easy to manufacture, but the height of the camera module is increased

Engineering Contradiction:

Improveease of manufactureVSAvoidheight

Core Design Contradiction:

Ease of manufactureVSLength of moving object

Solution Approach 1:

The patent transitions from a vertical stacking arrangement (thickness direction) to a planar integration arrangement. The lens unit, image sensor IC, and peripheral circuit components are arranged substantially in the same plane on the flexible substrate, changing the spatial dimension from 3D stacking to 2D layout. This dimensional change reduces the height of the camera module while maintaining the functional relationships between components.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a flexible substrate instead of a rigid multilayer substrate. This flexible film structure allows for planar integration of components and enables the camera module to achieve a thin profile. The flexible nature of the substrate also provides bending resistance when connected to flexible cables, addressing both height reduction and durability requirements.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If the camera module is directly mounted onto the mother board, then the connection is stable, but the thickness of the portable device is increased and a mounting region has to be secured

Engineering Contradiction:

Improveconnection stabilityVSAvoiddevice thickness

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The flexible substrate enables the camera module to be connected via flexible cables without requiring direct mounting on the mother board. This film-based connection method eliminates the need for a separate mounting region on the mother board and reduces the overall device thickness, while the flexible nature provides bending resistance for reliable connection.

Inventive Principle:

Principle #30Flexible shells and thin films

3Adaptability or versatility

If the rigid camera module is connected to the soft flexible cable, then the connection is flexible, but the connecting portion is susceptible to breakage due to bending or warping

Engineering Contradiction:

Improveconnection flexibilityVSAvoidconnection durability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent uses a flexible substrate for the camera module itself, matching the flexibility of the connecting cable. This flexibility compatibility prevents stress concentration at the connection interface, reducing the risk of breakage from bending or warping while maintaining connection flexibility.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the rigidity parameter of the camera module substrate from rigid to flexible, matching the mechanical properties of the connecting cable. This parameter change in material stiffness allows the connection to accommodate bending and warping without causing breakage, improving both flexibility and durability.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a thinner camera module with improved durability against bending and warping, reduced stress between layers, and enhanced optical characteristics, while preventing external light interference and ghosting issues.

Implementation Method 1

a lens unit (50) which condenses light to the light receiving element

Methodology Applied

Scientific EffectRefraction: Refraction

Data Source

PatentUS9986139B2Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same

Publication Date: 2018.05.29 MURATA MFG CO LTD

AI summary

A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.