Flexible Catheter Electrode Assembly for Non-Metallic Sensor Mounting
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Solution Overview
Problem
Existing catheter technologies face limitations in mounting non-metallic and asymmetric sensors due to the requirement of uniform metal bands for swaging, which is unsuitable for these types of sensors.
Innovation Solution
A flexible electrode construction using a flexible, electrically insulative substrate with a conductive layer and a via through the bonding layer, allowing for non-circular and non-metallic sensors to be mounted without swaging, utilizing reflow bonding for secure attachment to the catheter shaft.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If swaging is used to mount sensors onto the catheter shaft, then uniform metal bands can be securely attached, but non-metallic and asymmetric sensors cannot be mounted
Solution Approach 1:
The patent replaces the mechanical swaging process with a chemical bonding process using a bonding layer. This substitution eliminates the requirement for uniform metal bands and enables attachment of non-metallic and asymmetric sensors to the catheter shaft, directly resolving the contradiction between sensor type compatibility and manufacturing process complexity
Solution Approach 2:
The patent changes the bonding mechanism from mechanical deformation (swaging) to chemical adhesion through a bonding layer. This parameter change in the attachment method allows for versatile sensor types including non-metallic and asymmetric designs, while simplifying the overall manufacturing process
2Ease of manufacture
If swaging is used to attach sensors, then metal bands can be securely mounted, but the process is costly and complex
Solution Approach 1:
The patent substitutes the complex mechanical swaging system with a simpler chemical bonding system using a bonding layer. This replacement reduces manufacturing cost and complexity while maintaining secure sensor attachment through adhesive bonding, thereby improving ease of manufacture without sacrificing reliability
Solution Approach 2:
The patent introduces a bonding layer as an intermediary substance between the sensor and catheter shaft. This mediator enables reliable attachment of diverse sensor types through chemical adhesion, eliminating the need for complex mechanical swaging operations and reducing manufacturing cost and complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of non-circular and non-metallic sensors, provides additional sealing against fluid ingress, and reduces manufacturing cost and complexity.
Implementation Method 1
bonding the bonding layer to the catheter shaft. The step of bonding the bonding layer to the catheter shaft can include reflow bonding the bonding layer to the catheter shaft
Implementation Method 2
The step of securing the portion of the reverse surface of the conductive layer to the conductive contact can include soldering the portion of the reverse surface of the conductive layer to the conductive contact
Data Source
AI summary
A flexible electrode includes a flexible, electrically insulative substrate, a bonding layer disposed on a first surface of the substrate, a conductive layer disposed on a second surface of the substrate, and a via through the bonding layer and the substrate that exposes a portion of the reverse surface of the conductive layer. The exposed portion of the reverse surface can be secured (e.g., soldered) to a conductive contact, such as a conductive pill, on an exterior surface of a catheter shaft. The flexible electrode can then be wrapped around the exterior surface of the shaft to form a ring electrode and the bonding layer can be bonded to the catheter shaft, such as by reflow bonding.