Flexible Ceramic Packaging Cover Plate for OLED Displays
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Solution Overview
Problem
Current packaging structures for OLED display devices, especially curved or flexible ones, face issues with adhesion failure and poor thermal conductivity, leading to stress cracking and inadequate heat dissipation when bent or exposed to environmental changes.
Innovation Solution
A packaging cover plate made of flexible ceramic material with a groove structure filled with adhesive and thermally conductive materials, where the grooves are designed to improve adhesion and heat dissipation, comprising a composite material with specific host and binder materials and thermally conductive fillers like graphene or carbon nanotubes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a rigid packaging cover plate is used, then structural strength is improved, but flexibility and adhesion during bending deteriorate
Solution Approach 1:
The patent replaces rigid metal or non-metal packaging cover plates with a flexible ceramic material that can be bent without cracking. The flexible ceramic substrate maintains structural integrity while enabling the display device to be curved or folded, resolving the contradiction between strength and flexibility.
Solution Approach 2:
The patent uses composite flexible ceramic materials that combine the strength of ceramics with the flexibility needed for bent displays. This composite approach allows the packaging cover plate to maintain structural strength while adapting to curved configurations.
2Ease of manufacture
If adhesive material is applied without groove structure, then manufacturing simplicity is improved, but adhesion strength and stress resistance deteriorate
Solution Approach 1:
The patent introduces groove structures at specific locations on the packaging cover plate where adhesive material is applied. These localized grooves enhance adhesion strength and stress resistance at critical bonding interfaces without complicating the overall manufacturing process excessively.
Solution Approach 2:
The groove structures are pre-formed on the packaging cover plate before adhesive application. This preliminary structuring of the surface ensures optimal adhesion performance when the adhesive is applied, improving reliability without adding complex post-processing steps.
3Ease of manufacture
If traditional packaging material is used, then manufacturing cost is reduced, but thermal conductivity and heat dissipation efficiency deteriorate
Solution Approach 1:
The patent employs flexible ceramic materials with embedded thermally conductive components that provide superior heat dissipation compared to traditional packaging materials. The composite structure maintains cost-effectiveness while significantly improving thermal management for OLED displays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the stability and adhesion of the packaging structure during bending and improves heat dissipation efficiency, addressing the shortcomings of existing metal and non-metal packaging cover plates by using a flexible ceramic material with a groove structure filled with adhesive and thermally conductive materials.
Implementation Method 1
the groove structure is filled with an adhesive material and a thermally conductive material
Implementation Method 2
the groove structure is filled with an adhesive material and a thermally conductive material
Data Source
AI summary
The present disclosure provides a packaging cover plate, a method for manufacturing the same and a light emitting diode display, the packaging cover plate includes a cover plate body and a groove structure disposed on a first surface of the cover plate body, wherein the cover plate body comprises a flexible ceramic material, and the groove structure is filled with an adhesive material and a thermally conductive material. The packaging cover plate provided by the present disclosure has a bending property while having a barrier to water and oxygen, and does not undergo a shape change due to thermal expansion and contraction under a change of the ambient temperature. In addition, the present disclosure can improve the adhesion between the package cover plate and the packaging adhesive and improve the heat dissipation effect.