Flexible Charging Pad Structure for Flat Wireless Mouse Pads
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Solution Overview
Problem
Conventional wireless charging mouse pads face challenges in manufacturing, such as fixing the coil in place and maintaining tactile sensation due to coil bulging, which affects the product's structure and usability.
Innovation Solution
A flexible charging pad design featuring an adhesion layer, a conductor, a first pad layer, and a molded layer, where the conductor is attached between the pad layer and adhesion layer, and a heat-resistant double-sided tape and cladded conductive wire are used to prevent deformation and improve stacking during the in-mold forming process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coil is fixed inside the mouse pad using conventional methods, then wireless charging function is achieved, but the coil bulges out from the mouse pad surface affecting tactile sensation
Solution Approach 1:
The conductor is nested within multiple layers including the adhesion layer, first pad layer, and molded layer. The adhesion layer is disposed between the conductor and the first pad layer, while the molded layer covers both the conductor and first pad layer, creating a nested structure that embeds the coil completely within the mouse pad body, preventing bulging and maintaining smooth surface for tactile sensation
Solution Approach 2:
The solution transitions from a two-dimensional surface-level coil placement to a three-dimensional embedded structure. By stacking layers (adhesion layer, pad layer, molded layer) vertically, the conductor is positioned in multiple dimensions within the mouse pad thickness, achieving complete embedding that eliminates surface bulging while maintaining wireless charging functionality
2Productivity
If conventional manufacturing processes are used, then production can proceed, but it is hard to fix the coil for wireless transmission in place
Solution Approach 1:
The adhesion layer is applied to the conductor before assembling the complete mouse pad structure. This preliminary bonding action secures the conductor in its intended position within the layer stack, preventing displacement during subsequent manufacturing steps and ensuring accurate coil positioning without requiring complex post-assembly adjustments
Solution Approach 2:
Multiple functions are merged into a single integrated layer structure. The adhesion layer simultaneously provides bonding between layers and positional constraint for the conductor, while the molded layer both protects and further secures the conductor position. This merging of structural and positioning functions into integrated layers simplifies the manufacturing process and improves positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible charging pad structure is enhanced by preventing coil deformation and maintaining a flat surface, improving manufacturing efficiency and user experience by ensuring a smooth tactile sensation during use.
Implementation Method 1
The adhesion layer has a first adhesion surface and a second adhesion surface respectively located at two opposite sides of the adhesion layer. The conductor is attached on the first adhesion layer. The first pad layer is attached on the first adhesion surface and covers the conductor.
Implementation Method 2
disposing an adhesive to cover the conductor and the first pad layer, and to form a molded layer through an in-mold forming process. The molded layer covers the conductor and the first pad layer.
Data Source
AI summary
A flexible charging pad and a manufacturing method thereof are provided. The manufacturing method of the flexible charging pad includes: providing a double-sided tape to form an adhesion layer, one of two isolation papers is attached on the first adhesion surface, and another of the two isolation papers is attached on the second adhesion surface; removing the isolation paper attached on the first adhesion surface, and attaching a conductor on the first adhesion surface; attaching a first pad layer on the first adhesion surface to cover the conductor, the conductor is disposed between the first pad layer and the adhesion layer; disposing an adhesive to cover the conductor and the first pad layer, and to form a molded layer.