Embedded Flexible Circuit Layout for Low-Height AiP Packaging
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Solution Overview
Problem
The shrinking form factor of mobile devices poses a challenge for the design of antenna-in-package (AiP) devices, requiring reduced height and improved packaging techniques to accommodate integrated circuits and antennas within limited spaces.
Innovation Solution
A semiconductor device is designed with a substrate containing an antenna and a flexible circuit that is electrically coupled to an integrated circuit (IC) die, where the flexible circuit extends beyond the substrate's lateral extents with an electrical connector, allowing for reduced height and flexible placement within mobile devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the height of AiP devices is reduced to accommodate thinner mobile devices, then the device can be embedded in mobile devices with reduced thickness, but the available space for electrical connectors and wiring is reduced
Solution Approach 1:
The flexible circuit transitions from a planar configuration to a three-dimensional structure that extends beyond the substrate's lateral extents. This dimensional change allows the circuit to route connections in multiple directions and planes, providing connector placement flexibility without increasing the substrate height.
Solution Approach 2:
The flexible circuit provides dynamic routing capability, allowing the electrical connections to be positioned at various angles and locations relative to the substrate. This dynamic configuration enables the connector to be placed optimally for different embedding scenarios without being constrained by rigid, fixed-position wiring.
2Adaptability or versatility
If the flexible circuit extends beyond the substrate's lateral extents, then electrical connector placement flexibility is improved, but the device footprint increases
Solution Approach 1:
The flexible circuit is divided into distinct segments: a first portion disposed within the substrate's lateral extents and a second portion extending beyond the sidewalls. This segmentation allows the circuit to fulfill both functions - maintaining compact integration within the substrate area while providing extended routing capability for flexible connector placement.
Solution Approach 2:
The flexible circuit is integrated with the substrate in a nested configuration where the first portion of the circuit is embedded within or closely associated with the substrate structure, while the second portion extends outward. This nesting allows the circuit to leverage the substrate's space efficiently while providing external connection capability.
3Area of stationary object
If integrated circuits and antennas are integrated into a single package, then the footprint of functional modules is reduced, but the height of the package increases
Solution Approach 1:
The patent combines multiple functional components - the antenna in the substrate, the IC die with RF circuit, and the flexible circuit with electrical connector - into a single integrated AiP package. This merging consolidates what would traditionally be separate modules into one compact unit, reducing the overall footprint while the flexible circuit configuration helps manage the height constraint.
Data Source
AI summary
A semiconductor device includes a substrate comprising an antenna and a conductive feature; an integrated circuit (IC) die attached to the substrate and comprising a radio frequency (RF) circuit; and a flexible circuit integrated with the substrate, where the flexible circuit is electrically coupled to the IC die and the substrate, a first portion of the flexible circuit being disposed between opposing sidewalls of the substrate, a second portion of the flexible circuit extending beyond the opposing sidewalls of the substrate, the second portion of the flexible circuit comprising an electrical connector at a distal end.