Flexible Printed Circuit Board Alignment Using Multi-Mark Precision

The patent applies preliminary action by pre-defining multiple alignment marks (first, second, and third alignment marks) on both the flexible printed circuit board and display panel before the actual connection process. These marks are strategically positioned to enable precise alignment calculations, allowing the system to achieve high alignment precision without requiring complex real-time adjustment mechanisms during manufacturing.

The patent uses alignment marks as intermediary elements that mediate between the flexible printed circuit board and the display panel. By introducing these visible reference marks and using their spatial relationships (distances and angles) as intermediaries, the system can calculate and achieve precise alignment without directly measuring the complex geometric relationships between the components themselves, thus simplifying the overall alignment process while maintaining high precision.

The patent applies segmentation by dividing the alignment system into multiple segments: first alignment marks, second alignment marks, and third alignment marks, each serving specific functions. By segmenting the alignment process into multiple reference points rather than relying on a single long-distance measurement, the system can cover large display areas while maintaining measurement precision through multiple shorter, more accurate local measurements that can be mathematically combined.

The patent implements local quality by positioning different types of alignment marks (first, second, and third) at different locations with different functions. Each local region has optimized mark configurations suited to its specific requirements, allowing the system to achieve both wide coverage and high measurement precision in different areas simultaneously, rather than using a uniform approach that would compromise one or the other.