Flexible Circuit Board Bending for Display Battery Space
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face challenges in maximizing battery capacity within limited space due to the occupation of space by the display module and exposure of IC chips, leading to potential interference and performance issues.
Innovation Solution
A display device design that includes a flexible circuit board with a specific arrangement of areas and electromagnetic shielding layers, allowing for a compact structure that accommodates a large-capacity battery while protecting the driving chip from external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the flexible circuit board is extended to accommodate the driving chip and connections, then the connectivity and functionality are improved, but the space occupied increases, reducing battery installation space
Solution Approach 1:
The flexible circuit board utilizes the thickness dimension by bending to the back of the display area, transforming a planar layout into a three-dimensional configuration. This allows the circuit board to accommodate the driving chip and maintain connectivity while occupying minimal lateral space, thereby maximizing battery installation area.
Solution Approach 2:
The driving chip is bonded and connected to the display panel within the non-display area, effectively nesting the chip within the existing display structure. This nesting approach eliminates the need for separate mounting space for the driving chip, reducing overall device volume while maintaining full functionality.
2Ease of operation
If the IC chip is exposed for connection purposes, then the ease of connection is improved, but the device becomes susceptible to external electromagnetic interference
Solution Approach 1:
An electromagnetic shielding layer is introduced as an intermediary between the driving chip and the external environment. This shielding layer selectively blocks electromagnetic interference while allowing the driving chip to maintain its bonding and electrical connections to the display panel, thus protecting the chip without isolating it functionally.
Solution Approach 2:
The electromagnetic shielding layer is applied locally to the non-display area where the driving chip is located, rather than covering the entire device. This localized shielding approach provides targeted protection against electromagnetic interference while minimizing impact on the overall device structure and maintaining connection ease.
3Volume of moving object
If the flexible circuit board is made thinner to save space, then the volume is reduced, but the structural strength and bending durability deteriorate
Solution Approach 1:
Instead of reducing thickness to save space, the flexible circuit board utilizes the bending dimension by extending to the back of the display area. This three-dimensional configuration achieves space savings through spatial redistribution rather than thickness reduction, thereby maintaining the circuit board's structural strength and bending durability.
Data Source
AI summary
A display device includes a display panel, a flexible circuit board, and a driving chip. The display panel includes a display area and a non-display area bent to the back of the display area. The driving chip is bonded and connected to the display panel in the non-display area. The flexible circuit board includes a bonding area bonded to the non-display area, and a first flat area, a bending area, and a second flat area arranged in sequence in a direction away from the bonding area. The flexible circuit board is at the back of the display area. The second flat area is between the first flat area and the display area. A first electromagnetic shielding layer is provided on at least a portion of the surface, close to the display area, of the second flat area.