Flexible Circuit Board Corrosion Resistance via Composite Plating
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Solution Overview
Problem
Conventional flexible circuit boards used as current collectors in fuel cells face issues with high conduction resistance and corrosion, particularly under high-temperature and high-voltage conditions, due to the use of carbon-containing layers and weak adhesive forces between metal plating layers and flexible base materials, leading to conductor layer elution and corrosion.
Innovation Solution
A flexible circuit board design featuring a conductor layer formed on both sides of a flexible base material and inner walls of openings, with a conductive surface treatment film providing enhanced corrosion resistance, preventing interface issues between the coating layer and the base material, and ensuring stable electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a carbon containing layer is used to provide corrosion resistance, then corrosion resistance is improved, but conduction resistance increases
Solution Approach 1:
The patent uses a composite plating structure consisting of a copper layer (for low conduction resistance) and a nickel layer (for corrosion resistance). This composite material approach allows simultaneous achievement of both low electrical resistance and high corrosion resistance by combining materials with complementary properties.
2Loss of energy
If metal plating layers are used to reduce conduction resistance, then conduction resistance is improved, but adhesive force between coating layer and base material decreases
Solution Approach 1:
The patent employs a composite plating structure with copper and nickel layers. The nickel layer provides strong adhesion to the flexible base material while the copper layer provides low conduction resistance. This composite approach resolves the contradiction between adhesion strength and electrical conductivity.
Solution Approach 2:
The nickel layer acts as an intermediary between the flexible base material and the copper conductor layer. It provides strong adhesion to the base material while allowing the copper layer to maintain low electrical resistance, thus mediating between the requirements for adhesion and conductivity.
3Reliability
If conventional coating structures are used to provide corrosion resistance, then corrosion resistance is improved, but conductor layer elution occurs under high-temperature and high-voltage conditions
Solution Approach 1:
The patent uses a composite plating structure with copper and nickel layers where the nickel layer provides superior corrosion resistance and protects the copper conductor layer from elution under high-temperature and high-voltage conditions. This composite structure maintains conductor layer stability while providing corrosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents corrosion and elution of the conductor layer, maintaining stable output voltage and electrical connectivity even under harsh conditions, thereby enhancing the performance and reliability of fuel cells.
Implementation Method 1
a conductive surface treatment film formed on top of the conductor layer, the conductive surface treatment film having corrosion resistance higher than that of the conductor layer
Data Source
AI summary
There is provided a flexible circuit board capable of preventing corrosion and elution of a conductor layer constituting a current collector even under high-temperature and high-voltage working conditions while achieving sufficient electric connection with an MEA. A flexible circuit board having a current collector of a fuel cell provided thereon includes an insulating flexible base material 1, a plurality of openings 5 that supply fuel or air, the openings 5 being provided in a specified region so as to penetrate through the flexible base material 1 in a thickness direction, a plating film 6 that constitutes the current collector, the plating film 6 being formed on front and back surfaces of the flexible base material 1 in the specified region and on inner walls of the openings 5, a surface treatment film 9 formed on the plating film 6 and having corrosion resistance higher than that of the plating film.