Integrated Flexible Circuit Board for Transparent Display

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Solution Overview

Problem

Conventional flexible circuit boards for transparent display boards face issues such as easy tearing, complex assembly processes, non-uniform pressure and temperature distribution during bonding, leading to low bonding force and potential electric disconnection, and variations in brightness due to separate power and signal line connections.

Innovation Solution

Integration of signal and power line patterns into a single flexible circuit board with an electrode bonding portion, dummy terminals at the periphery to resist pressure and vibration, and a hard substrate to increase bonding area and durability, allowing for stable ultrasonic bonding and simultaneous connection of power and signal lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If separate power connectors and flexible circuit board are used, then power supply and signal transfer are achieved, but device complexity increases and assembly becomes complex

Engineering Contradiction:

Improvestructure complexityVSAvoidconnection reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent combines the flexible circuit board and power connectors into a single integrated flexible circuit board structure. The power line patterns and signal line patterns are both formed on the same flexible substrate, eliminating the need for separate power connectors and reducing structural complexity while maintaining reliable electrical connections.

Inventive Principle:

Principle #5Merging (Combining)

2Strength

If conventional flexible circuit board is used, then signal transfer is achieved, but the board is easily torn and durability is low

Engineering Contradiction:

Improvebonding forceVSAvoiddurability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The flexible circuit board uses a composite structure with a flexible substrate and copper-clad hard substrate portions. This composite design combines the flexibility of the substrate with the strength of the copper-clad regions, preventing easy tearing while maintaining the necessary flexibility for installation and durability during ultrasonic bonding.

Inventive Principle:

Principle #40Composite materials

3Manufacturing precision

If ultrasonic bonding is applied to conventional flexible circuit board, then bonding is achieved, but temperature and pressure distribution is non-uniform leading to low bonding force

Engineering Contradiction:

Improvebonding uniformityVSAvoidbonding process difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The flexible circuit board incorporates copper-clad hard substrate portions at specific locations where bonding is required. These localized copper-clad regions have different thermal and mechanical properties compared to the flexible substrate, ensuring uniform temperature and pressure distribution during ultrasonic bonding while maintaining overall flexibility of the circuit board.

Inventive Principle:

Principle #3Local quality

4Illumination intensity

If separate power and signal line connections are used, then electrical connections are achieved, but brightness varies due to non-uniform connection

Engineering Contradiction:

Improvebrightness uniformityVSAvoidconnection structure

Core Design Contradiction:

Illumination intensityVSDevice complexity

Solution Approach 1:

The power line patterns and signal line patterns are both formed on the same flexible circuit board substrate, ensuring uniform connection characteristics. This integrated structure eliminates variations in connection quality between separate power and signal connections, resulting in uniform brightness across the transparent display board.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the durability of the flexible circuit board, reduces temperature and pressure differences during bonding, shortens manufacturing time, and ensures uniform brightness by eliminating the need for separate metal terminals, resulting in improved production productivity and bonding force.

Implementation Method 1

stabilizing the flexible circuit board during the ultrasonic bonding

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 2

heats and bonds the flexible circuit board to the transparent plate through ultrasonic vibration

Methodology Applied

Scientific EffectUltrasonic heating: Ultrasonic Vibration

Data Source

PatentUS20180146549A1Durable flexible circuit board for transparent display board and assembling method thereof

Publication Date: 2018.05.24 G SMATT CO LTD

AI summary

A durable flexible circuit board for a transparent display board is connected between a driver board provided with at least one of a power supply and a controller and a transparent plate provided with a plurality of light emitting elements. The flexible circuit board includes an electrode bonding portion provided with a plurality of signal connection terminals for transferring control signals, at least one power connection terminal for transferring electric power, and at least one dummy terminal disposed outside the signal connection terminal or the power connection terminal disposed at the outermost side. The dummy terminal resists vibration and pressure applied to the signal connection terminal or the power connection terminal disposed at the outermost side. The signal connection terminal and the power connection terminal are integrated in the flexible circuit board.