Flexible Circuit Board Metal Pattern Heat Dissipation
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Solution Overview
Problem
Existing display technologies face challenges in effectively radiating heat from integrated circuit elements on flexible circuit boards without relying on additional components like conductive tapes or metal chassis, especially in flexible displays with bendable panels.
Innovation Solution
A display design that incorporates a metal pattern connected to the power source lines on the circuit board, allowing direct contact with the integrated circuit elements, either directly or through a thermal conductor, to efficiently dissipate heat to the display panel with a larger heat capacity, eliminating the need for additional components like conductive tapes or metal chassis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional flexible circuit boards without additional heat radiation components are used, then device complexity is reduced, but heat dissipation capability is insufficient
Solution Approach 1:
The patent merges the heat dissipation function with the existing power source line structure by forming a metal pattern that serves both as an electrical connection and a thermal conduction path. This integration eliminates the need for separate heat radiation components while maintaining effective heat dissipation from the integrated circuit element.
Solution Approach 2:
The metal pattern on the flexible circuit board performs multiple functions: it provides electrical power supply through connection to the power source line and simultaneously acts as a heat dissipation structure through thermal conduction to the integrated circuit element. This multi-functionality resolves the contradiction by adding heat dissipation capability without increasing structural complexity.
2Temperature
If additional components like conductive tape are added for heat radiation, then heat dissipation capability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the heat dissipation function with the existing power source line structure by forming a metal pattern that serves both as an electrical connection and a thermal conduction path. This integration eliminates the need for separate heat radiation components while maintaining effective heat dissipation from the integrated circuit element.
Solution Approach 2:
The flexible circuit board's metal pattern serves itself dual purposes: electrical power supply and heat dissipation. By utilizing the existing structural elements for multiple functions, the invention avoids additional components and reduces manufacturing complexity while achieving effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high heat dissipation from integrated circuit elements on circuit boards, improving thermal management without requiring additional components or manufacturing processes, and is applicable to both flexible and conventional liquid crystal displays.
Implementation Method 1
the metal pattern is in contact with an outer surface of the integrated circuit element directly or via a thermal conductor
Data Source
AI summary
A display includes: a display panel; and a flexible circuit board connected to the display panel, and including power source lines for supplying driving current to the display panel, a signal line for transmitting a control signal to the display panel, and an integrated circuit element, in which the flexible circuit board includes a metal pattern connected to the power source lines, and the metal pattern is in contact with an outer surface of the integrated circuit element directly or via a thermal conductor.