Flexible Circuit Board Pad Alignment for Thin Endoscope Sensors
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Solution Overview
Problem
It is challenging to integrate a micro image sensor with small dimensions into an endoscope due to the difficulty in disposing it on a flexible circuit board while maintaining a thin tube structure for comfort.
Innovation Solution
The image capturing module features a flexible circuit board with first and second pads on opposite surfaces, where the image sensor is placed between them, allowing the board to be folded and welded such that the light receiving surface is perpendicular to the pads, enabling easy insertion into an endoscope tube.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a micro image sensor with small dimensions is used to reduce the thickness of the endoscope tube, then the comfort for the human body is improved, but the difficulty of disposing the image sensor on the flexible circuit board increases
Solution Approach 1:
The flexible circuit board is folded to bring pads from opposite surfaces into alignment, transitioning from a planar two-dimensional layout to a three-dimensional folded structure. This allows the image sensor to be connected to pads on both surfaces of the flexible circuit board, enabling integration of small-dimensional sensors while maintaining a thin overall structure.
Solution Approach 2:
The image sensor is positioned between the first and second pads, with the flexible circuit board folded around it. This nested arrangement allows the circuit board to wrap around the sensor, connecting to pads on both surfaces while keeping the assembly compact and suitable for thin tube integration.
2Reliability
If the flexible circuit board is folded to align and weld pads from opposite surfaces, then the image sensor can be properly integrated, but the manufacturing process complexity increases
Solution Approach 1:
Pads are pre-formed on both surfaces of the flexible circuit board at positions that will align after folding. The image sensor is positioned between these pads before the folding and welding operations, ensuring proper alignment and connection without requiring complex real-time adjustment during assembly.
Solution Approach 2:
The folding and welding operations are combined into a single integrated process step. The flexible circuit board is folded to align the pads, and welding is performed simultaneously to join the pads, reducing the number of separate manufacturing steps and simplifying the overall process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the manufacturing process and allows for the installation of micro image sensors within thin endoscope tubes, enhancing the comfort and functionality of the endoscope.
Implementation Method 1
The flexible circuit board is folded to align and weld the first pads with the second pads
Data Source
AI summary
An image capturing module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The first pads are disposed on a first surface of the flexible circuit board and the second pads are disposed on a second surface of the flexible circuit board, wherein the first surface is opposite to the second surface. The image sensor is disposed on the first surface. A distance between the image sensor and the first pads is identical to a distance between the image sensor and the second pads. The flexible circuit board is folded to align and weld the first pads with the second pads, such that a light receiving surface of the image sensor is perpendicular to surfaces of the first and second pads.