Flexible Circuit Board Architecture for Phased Array Antennas
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Solution Overview
Problem
The design of phased array antennas is constrained by the size of circuit boards, making it difficult to achieve complex beam forming networks and simultaneous communication with multiple targets, especially at high frequencies, due to the need for mechanical interconnections and complex connectors, which are costly and challenging to manufacture and test.
Innovation Solution
The use of a modular electronic architecture where antenna radiator elements are formed on a first rigid circuit board interconnected to additional rigid circuit boards via a flexible circuit board, allowing for the expansion of circuitry into three dimensions and reducing the need for mechanical connectors, enabling the creation of phased array antenna assemblies with increased beam control capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional circuit boards are placed behind the antenna element board to provide beam forming networks, then the number of controllable beams increases, but the device complexity and manufacturing difficulty increase due to mechanical interconnections and stringent tolerances
Solution Approach 1:
The patent transitions from planar circuit board arrangements to a three-dimensional folded configuration. The flexible circuit board is folded to position circuit components in three-dimensional space while maintaining electrical connections, thereby increasing the number of controllable beams without proportionally increasing mechanical interconnection complexity.
Solution Approach 2:
The patent employs a flexible circuit board instead of rigid circuit boards to enable folding and three-dimensional configuration. This flexible substrate allows the circuitry to be bent and folded into compact arrangements, reducing the need for complex mechanical interconnections between separate rigid boards.
2Adaptability or versatility
If mechanical interconnections are used to connect additional circuit boards, then beam forming capabilities are enhanced, but manufacturing precision requirements become more stringent and costly
Solution Approach 1:
The flexible circuit board inherently accommodates manufacturing tolerances through its flexibility, eliminating the need for precision-machined mechanical interconnections. The flexible substrate can bend and conform to slight variations in alignment, thereby reducing manufacturing precision requirements while maintaining electrical connectivity.
Solution Approach 2:
The patent replaces mechanical interconnection systems (screws, connectors, mounting brackets) with a flexible circuit board system that provides both structural support and electrical connectivity. This substitution eliminates complex mechanical assembly requirements and reduces tolerance sensitivity.
3Adaptability or versatility
If the area of circuit board is increased to accommodate complex beam forming networks, then more beams can be controlled simultaneously, but the size of the antenna system increases
Solution Approach 1:
The patent utilizes three-dimensional space by folding the flexible circuit board, allowing circuit components to be arranged vertically and in multiple layers rather than spread out in a single plane. This dimensional transition enables complex beam forming networks to be packed into a smaller footprint area.
Solution Approach 2:
The folded flexible circuit board creates a nested, multi-layered structure where circuit boards are stacked and interconnected in three-dimensional space. This nesting approach allows multiple circuit layers to occupy overlapping two-dimensional footprints, effectively increasing the functional circuit area without increasing the overall system footprint.
4Ease of manufacture
If conventional production techniques are used for phased array antennas with mechanical interconnections, then manufacturing is possible, but testing and repair require disassembly and are time-consuming
Solution Approach 1:
The patent divides the antenna system into modular units, each containing a folded flexible circuit board with integrated circuitry. These modular units can be independently tested and repaired, and then reassembled into the complete antenna system. This segmentation eliminates the need to disassemble complex mechanical interconnections for testing and repair.
Solution Approach 2:
The flexible circuit board's flexibility enables the modular units to be easily assembled and disassembled without damaging rigid mechanical connections. This facilitates rapid testing and repair operations while maintaining ease of manufacture through conventional techniques.
Data Source
AI summary
A modular electronic architecture is provided. In particular, one or more unit sub-arrays providing at least a portion of the antenna radiator elements and supporting circuitry comprising at least part of a phased array antenna are provided. Each unit sub-array includes a first area comprising a rigid circuit board on which one or more antenna radiator elements are formed. In addition, a second area of rigid circuit board material for supporting circuitry is provided. The first and second areas are interconnected to one another by a region of flexible circuit board material having connective traces. Methods for forming unit sub-arrays providing antenna radiator elements and supporting circuitry are also provided. More particularly, a completed unit sub-array may be formed while the associated circuit boards are in a flat or planar condition. Following any desired verification of the operating status of the circuit board, supporting structure can be machined away, allowing the unit sub-array to be folded for inclusion in a phased array antenna assembly.