Flexible Circuit Board Pin Alignment Compensation
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Solution Overview
Problem
The challenge in manufacturing liquid crystal display panels is that flexible circuit boards shrink during bonding, leading to misalignment or short-circuiting of pins, resulting in defects and abnormal display issues.
Innovation Solution
A method is developed to improve pin alignment accuracy by performing linear shrinkage on the pin positions of the flexible circuit board based on heat expansion, adjusting the spacing between pins, and using a subtraction and addition operation to determine the precise pin positions, ensuring accurate alignment after bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the flexible circuit board is heated for bonding with the liquid crystal display panel, then the bonding strength is improved, but the pins on the flexible circuit board and the pins on the liquid crystal display panel become misplaced or short-circuited
Solution Approach 1:
The patent applies preliminary action by pre-calculating and pre-adjusting the pin positions on the flexible circuit board to account for the expected thermal expansion during bonding. The pin positions are adjusted in advance based on the thermal expansion coefficient and bonding temperature, so that after heating, the pins automatically align with the corresponding pins on the liquid crystal display panel without requiring post-bonding adjustment.
Solution Approach 2:
The patent utilizes parameter changes by modifying the pin position parameters on the flexible circuit board design stage. The pin coordinates are recalculated using the thermal expansion formula, changing the positional parameters from the original design values to compensated values that account for thermal expansion, thereby ensuring accurate alignment after heating.
2Manufacturing precision
If the pin spacing is reduced to compensate for shrinkage, then the alignment accuracy is improved, but the risk of pin short-circuiting increases
Solution Approach 1:
The patent applies parameter changes by precisely calculating the optimal pin spacing using the thermal expansion coefficient and bonding temperature parameters. The pin spacing is adjusted by a specific amount that exactly compensates for the expected shrinkage, rather than using excessive reduction, thereby maintaining both alignment accuracy and adequate spacing to prevent short-circuits.
Solution Approach 2:
The patent employs feedback by using the actual thermal expansion data and bonding process parameters to iteratively optimize the pin position compensation values. The alignment results from test bonding are fed back to refine the compensation calculations, ensuring that the pin spacing is precisely tuned to achieve accurate alignment without creating short-circuit risks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances pin alignment accuracy, preventing misplacement or short-circuiting, thereby reducing product defects and improving the overall quality of the display device.
Implementation Method 1
because the flexible circuit board shrinks when being heated for bonding with the liquid crystal display panel
Data Source
AI summary
A manufacturing method of a circuit board and a display device are provided. In the method, an error caused by that pin alignment on a conventional flexible substrate after a pin column is disposed on the flexible substrate based on a second pin position and a hot pressing process is performed is adjusted, so that the pin alignment is more accurate after the flexible substrate on which a pin is disposed based on a position of the to-be-disposed pin column is finally hot pressed with the display panel, thereby avoiding a problem that the pin is misplaced or short-circuited, and improving a good rate of the product.