Flexible Circuit Board RF Line Bundling
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Solution Overview
Problem
In wireless terminals, the use of flexible circuit boards for RF signal transmission lines leads to increased space occupation and signal loss due to the need for separate connectors and longer transmission lengths, which complicates spatial efficiency and interferes with other components.
Innovation Solution
A flexible circuit board design where two or more RF transmission lines are bundled in parallel in the thickness direction, with a shielding part and RF transmission parts disposed to reduce space occupation and connector count, and integrated with a normal signal transmission part to minimize signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If flexible circuit board is used for RF transmission lines, then space utilization is improved, but signal loss increases due to longer transmission length
Solution Approach 1:
The patent transitions RF transmission lines from a planar arrangement to a three-dimensional bundled structure in the thickness direction. Multiple RF transmission lines are stacked vertically and bundled together, utilizing the Z-axis dimension to reduce the horizontal footprint while maintaining signal integrity through the bundled configuration.
Solution Approach 2:
Multiple RF transmission lines are merged into a single bundled structure. The patent combines multiple individual transmission lines into one integrated flexible circuit board assembly, reducing the number of separate connectors and minimizing signal loss through the unified bundled configuration.
2Volume of moving object
If flexible circuit board is used for RF transmission lines, then spatial efficiency is improved, but device complexity increases due to more connectors
Solution Approach 1:
Multiple RF transmission lines that would traditionally require separate connectors are merged into a single bundled flexible circuit board assembly. This consolidation reduces the number of connectors needed while maintaining the functionality of multiple RF channels.
Solution Approach 2:
The bundled flexible circuit board assembly serves multiple functions simultaneously - it transmits multiple RF signals through different lines within the bundle while occupying minimal space. This multi-functional design eliminates the need for separate connector assemblies for each RF line.
3Reliability
If RF transmission lines are spaced apart to prevent signal interference, then signal quality is improved, but space occupation increases
Solution Approach 1:
The patent resolves the interference problem by moving RF transmission lines from a two-dimensional planar layout to a three-dimensional vertical stack. Lines are arranged in the thickness direction with shielding layers between them, maintaining adequate spacing for signal integrity while minimizing horizontal space occupation.
Solution Approach 2:
Multiple RF transmission lines are nested within a bundled structure, with each line positioned in a different vertical layer. Shielding layers are nested between the RF lines to prevent interference, creating a compact nested arrangement that maintains signal quality while reducing overall space requirements.
Data Source
AI summary
A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.