Flexible Circuit Board Connecting Stacked PCBs

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Solution Overview

Problem

Traditional methods for connecting stacked circuit boards using hollowed plates with through holes are complex and costly, requiring sophisticated processes and equipment.

Innovation Solution

A method utilizing a flexible circuit board with a copper layer, adhesive layer, and cover layer, featuring bendable and flexible connecting structures with supporting posts, simplifies the process and reduces costs by using surface mounting or drilling techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional hollowed plate with through holes is used for connecting circuit boards, then electrical connection is achieved, but the process becomes complicated and cost increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidprocess complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the through-hole drilling and metallization processes from the connection method, replacing them with surface-mount technology. The connecting structure uses surface-mounted pads and conductive patterns instead of requiring holes through the entire board, thereby eliminating complex drilling and plating operations while maintaining electrical connectivity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The connecting structure is segmented into distinct functional layers: solder resist layer with pads, conductive trace layer, and insulating substrate. This segmentation allows each layer to be optimized independently and simplifies manufacturing by enabling separate processing of conductive and insulating features before final assembly.

Inventive Principle:
Principle #1Segmentation

2Reliability

If traditional hollowed plate with through holes is used for connecting circuit boards, then electrical connection is achieved, but manufacturing cost increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs standard FR-4 PCB material and conventional surface-mount components instead of expensive specialized through-hole connectors or metallization processes. The connecting structure uses ordinary solder paste and reflow soldering technology, which are cost-effective and widely available in modern electronics manufacturing.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The connecting structure serves multiple functions simultaneously: it provides electrical connection, mechanical support, and signal routing all within a single integrated PCB design. This multi-functionality eliminates the need for separate through-hole connectors, reducing part count and assembly complexity while lowering overall manufacturing cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If circuit boards are stacked to increase surface-mounting area, then more passive components can be mounted, but connection complexity increases

Engineering Contradiction:
Improvesurface-mounting areaVSAvoidconnection structure
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent merges the connecting structure with the circuit board itself, using the PCB as both the mounting platform and the connection medium. Surface-mounted pads and conductive traces are integrated directly into the board layers, eliminating the need for separate connecting components and simplifying the overall assembly while enabling multi-board stacking.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11483938B2Method for connecting stacked circuit boards
Publication Date: 2022.10.25 AVARY HLDG (SHENZHEN) CO LTD
  • US11483938B2 patent drawing
  • US11483938B2 patent drawing
  • US11483938B2 patent drawing

AI summary

A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.