Flexible Circuit Boards in Electronic Apparatus Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multi-layer rigid circuit boards in small electronic devices result in increased thickness and weight, hindering compact and lightweight design objectives.
Innovation Solution
The use of flexible circuit boards accommodated within a frame structure, with hardware devices mounted on these boards, allowing for a thinner and lighter electronic apparatus by leveraging the reduced thickness and weight of flexible circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multi-layer rigid circuit boards are used to increase layout area, then circuit layout capability is improved, but thickness and weight increase
Solution Approach 1:
The patent replaces rigid multi-layer circuit boards with flexible circuit boards that have a thickness of 5-20 micrometers. These flexible circuits are folded or rolled to achieve the necessary layout area while maintaining extreme thinness and lightness, directly resolving the contradiction between layout area and weight.
Solution Approach 2:
The patent transitions from planar rigid circuit boards to three-dimensional folded/rolled flexible circuits. By utilizing the third dimension (folding and rolling), the circuit layout area is significantly increased without increasing the linear dimensions or weight of the circuit board.
2Area of stationary object
If multi-layer rigid circuit boards are used to increase layout area, then circuit layout capability is improved, but thickness increases
Solution Approach 1:
The patent employs flexible circuit boards with a thickness of 5-20 micrometers, which are dramatically thinner than conventional rigid PCBs. The flexible nature allows these thin boards to be folded or rolled to achieve the required layout area, directly resolving the thickness contradiction.
Solution Approach 2:
By folding and rolling the flexible circuit boards, the patent utilizes three-dimensional space to achieve extensive layout area while maintaining minimal thickness. The circuit board is compressed into a compact form factor through folding/rolling while preserving the full circuit functionality.
3Stability of the object's composition
If rigid circuit boards are used for hardware mounting, then structural stability is improved, but device lightweighting is hindered
Solution Approach 1:
The patent replaces heavy rigid circuit boards with ultra-thin flexible circuit boards (5-20 micrometers). The flexible circuits provide sufficient structural stability for mounting hardware devices while reducing the weight significantly, as they are made from lightweight flexible substrates.
Solution Approach 2:
The patent employs flexible circuit boards that can bend and deform elastically. This dynamic flexibility allows the circuits to conform to various shapes and provide structural support where needed, while maintaining their lightweight advantage over rigid boards.
Data Source
AI summary
An electronic apparatus includes a frame, a plurality of flexible circuit boards, and a plurality of hardware devices. The frame includes a first frame body and a second frame body. The first frame body and the second frame body are spaced apart from each other, and define an accommodation space therebetween. The flexible circuit boards are accommodated in the accommodation space. Each flexible circuit board includes a first edge and a second edge opposite to the first edge. The first edge is connected to the first frame body. The second edge is connected to the second frame body. The hardware devices are disposed on the corresponding flexible circuit boards.