Flexible Printed Circuit Board Bonding Method for Display Devices
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Solution Overview
Problem
In the manufacturing of display devices, mechanical errors and substrate deformation lead to shifted bonding positions of flexible printed circuit boards, resulting in unqualified bonding and low reliability due to space constraints on the connection circuit board.
Innovation Solution
A bonding method where flexible printed circuit boards are initially bonded to a substrate with their second areas extending beyond the first side, then cut to ensure all second sides are flush and parallel, allowing for precise alignment and bonding to a connection circuit board without occupying excessive space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If flexible printed circuit boards are bonded directly to the connection circuit board without cutting, then the bonding process is simpler, but the second areas extend beyond the substrate causing excessive space occupation and unqualified bonding
Solution Approach 1:
The flexible printed circuit boards are preliminarily bonded to the substrate in a first area before the final bonding to the connection circuit board. This preliminary bonding allows for subsequent cutting operations to precisely define the second sides, ensuring accurate final positioning while maintaining process simplicity through staged manufacturing
Solution Approach 2:
The bonding process is segmented into two distinct stages: first bonding to the substrate in a first area, then cutting to define precise boundaries, and finally bonding to the connection circuit board in a second area. This segmentation allows each stage to be optimized independently for both ease and precision
2Ease of operation
If the second areas of flexible printed circuit boards extend beyond the first side of the substrate, then alignment is easier, but excessive space is occupied on the connection circuit board
Solution Approach 1:
The flexible printed circuit boards are preliminarily positioned and bonded to the substrate with their second areas extending beyond the first side, providing alignment reference. Subsequently, cutting operations precisely trim the second sides to define exact boundaries, maintaining alignment ease while controlling final space occupation on the connection circuit board
Solution Approach 2:
The excess portions of the flexible printed circuit boards extending beyond the substrate are removed through cutting operations. This extraction of unnecessary material maintains the alignment benefits of extended areas during bonding while eliminating excessive space occupation on the connection circuit board
3Area of stationary object
If cutting operations are performed to make second sides flush, then space usage on connection circuit board is optimized, but the manufacturing process becomes more complex
Solution Approach 1:
The flexible printed circuit boards are preliminarily bonded to the substrate before cutting operations. This preliminary bonding provides stable reference and support during cutting, enabling precise trimming to optimize space usage while managing manufacturing complexity through proper process sequencing
Solution Approach 2:
The substrate serves as an intermediary platform during the manufacturing process. Flexible printed circuit boards are first bonded to the substrate, allowing cutting operations to be performed with proper support and reference. This intermediary role of the substrate simplifies the overall manufacturing complexity while achieving optimized space usage
Data Source
AI summary
The disclosure provides a bonding method, the bonding method includes: bonding first areas of a plurality of flexible printed circuit boards on a substrate, the plurality of flexible printed circuit boards being sequentially arranged along a direction parallel to a first side of the substrate, and a second area of each of the flexible printed circuit boards exceeds the first side; cutting at least one of the flexible printed circuit boards to enable second sides of all the flexible printed circuit boards to be flush and parallel to the first side, wherein each of the second sides is a side of the second area away from the first area; and bonding second areas of the flexible printed circuit boards with a connection circuit board.