Flexible Circuit Channels for Folding and Connection

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Solution Overview

Problem

Conventional flexible circuits have limited flexibility due to their materials and dimensions, making them unsuitable for applications with small or limited packaging space, such as autonomous electrified vehicles, where improved folding and connection capabilities are needed.

Innovation Solution

The development of flexible circuits with conductive circuit traces and a dielectric layer featuring channels that extend through the thickness of the layer, providing increased flexibility and support, and potentially formed by laser processing, which can include identifiers for type and installation location.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional FC materials and dimensions are used, then the FC maintains structural integrity, but the flexibility is limited

Engineering Contradiction:
Improvestructural integrityVSAvoidflexibility
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

The dielectric layer is segmented into multiple discrete channels extending through its thickness, creating a series of parallel voids between conductive traces. This segmentation allows the structure to bend and flex more easily while maintaining overall integrity, as the channels act as flexible hinges between rigid sections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The dielectric layer incorporates channels that create a porous structure, reducing material density and increasing flexibility. These channels allow the dielectric layer to deform more readily under bending stresses while maintaining structural support for the conductive traces.

Inventive Principle:
Principle #31Porous materials

2Strength

If the dielectric layer thickness is increased for support, then strength is improved, but flexibility is reduced

Engineering Contradiction:
Improvesupport capabilityVSAvoidfolding capability
Core Design Contradiction:
StrengthVSAdaptability or versatility

Solution Approach 1:

By dividing the dielectric layer into sections separated by channels, the patent achieves both thickness-related strength and flexibility. The channels create natural bending planes that allow the thicker dielectric structure to fold without compromising overall support capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The channels extend through the thickness dimension of the dielectric layer, creating a three-dimensional structure that provides support in one dimension while enabling flexibility in another. This dimensional approach allows simultaneous achievement of strength and foldability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If channels are added to increase flexibility, then adaptability is improved, but manufacturing complexity increases

Engineering Contradiction:
ImproveflexibilityVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent optimizes channel parameters such as spacing, diameter, and depth to achieve desired flexibility while maintaining manufacturability. By carefully controlling these parameters, the structure gains adaptability without excessive complexity in fabrication.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the flexibility and strength of the circuits, allowing for improved folding and connection capabilities, reducing packaging space requirements and offering design/installation flexibility, while maintaining conductive properties.

Implementation Method 1

at least some of the plurality of channels are formed by laser processing

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS11533807B2Integral features providing improved flexible printed circuit folding and connection capability
Publication Date: 2022.12.20 APTIV MANUFACTURING MANAGEMENT SERVICES GMBH
  • US11533807B2 patent drawing
  • US11533807B2 patent drawing
  • US11533807B2 patent drawing

AI summary

A flexible circuit (FC) and a method of forming the FC each include providing a first dielectric layer, applying a plurality of conductive circuit traces that are substantially parallel to each other to the first dielectric layer, providing a second dielectric layer atop the first dielectric layer and the plurality of conductive circuit traces to form a third dielectric layer having the plurality of conductive traces disposed therein and being configured to support and insulate the plurality of conductive traces, and forming a plurality of channels extending at least partially through a thickness of the third dielectric layer, wherein the plurality of channels are arranged between the plurality of conductive circuit traces and substantially parallel thereto and are configured to provide increased flexibility of the FC.