Multi-Layer Flexible Circuit Board Interconnection via Conductive Pillars

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Solution Overview

Problem

The existing signal transmission devices in touch control liquid crystal displays face limitations in size reduction due to the need for multiple ports for signal transmission and are prone to variations in the soldering process, which affects the quality and consistency of connections between flexible printed circuit boards.

Innovation Solution

A signal transmission device comprising multiple flexible printed circuit boards with insulating layers and conductive pillars, where the second and third circuit layers are electrically connected to the system through the first circuit layer, eliminating the need for multiple ports and reducing soldering-related errors by using a multi-layer structure with through holes and conductive pillars for interlayer conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple flexible printed circuit boards are connected through soldering to transmit signals to the system, then the system only needs space for one port, but the soldering process is prone to variation and quality control issues

Engineering Contradiction:
Improveconnection qualityVSAvoidsoldering consistency
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces the mechanical soldering process with a direct lamination bonding process. The flexible printed circuit boards are bonded together through insulating layers without requiring soldering, thereby eliminating the variability and quality control issues associated with manual or automated soldering processes while maintaining electrical connectivity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces insulating layers with conductive patterns as intermediaries between the flexible printed circuit boards. These insulating layers serve as both mechanical bonding media and electrical connection pathways, eliminating the need for soldering while ensuring reliable signal transmission between layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If three separate ports are used to transmit signals from the LCD panel, touch panel, and light source to the system, then signal transmission is straightforward, but the system requires larger space for multiple ports

Engineering Contradiction:
Improvesignal transmission simplicityVSAvoidsystem space
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The patent merges multiple signal transmission pathways into a single integrated structure. The insulating layers contain conductive patterns that combine the signal paths from the LCD panel, touch panel, and light source into unified transmission routes, allowing all signals to be transmitted through one port while maintaining clear signal separation through the layered insulating structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a planar arrangement requiring multiple ports to a three-dimensional layered structure. By stacking flexible printed circuit boards with insulating layers containing conductive patterns, the system utilizes the vertical dimension to route multiple signals through a single port, thereby reducing the horizontal space required at the system interface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11445611B2Signal transmission apparatus and display apparatus
Publication Date: 2022.09.13 HKC CORP LTD
  • US11445611B2 patent drawing
  • US11445611B2 patent drawing
  • US11445611B2 patent drawing

AI summary

The present disclosure illustrates a signal transmission device and a display device using the same. The signal transmission device includes a first flexible printed circuit board comprising a first circuit layer and a connection member, wherein the first circuit layer is electrically connected to a display module and a system; a second flexible printed circuit board disposed on the first flexible printed circuit board, and comprising a second circuit layer; a third flexible printed circuit board disposed on the first flexible printed circuit board, and comprising a third circuit layer; insulating layers disposed between the first, second and third flexible printed circuit boards, and comprising a plurality of through holes formed thereon in a vertical direction; and conductive pillars disposed in the through holes, respectively, wherein the second and third circuit layer are electrically connected to the system through the first circuit layer and the conductive pillars.