Flexible Circuit for Non-Destructive Semiconductor Device Detachment

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Solution Overview

Problem

Existing semiconductor device assemblies are difficult to detach from system boards without damage due to solder mounting, leading to the need for replacing entire boards or devices when a single semiconductor device fails.

Innovation Solution

A semiconductor device assembly comprising a substrate and a flexible member with a conducting layer, where a connector is attached to the flexible member, allowing for electrical connection to a second substrate, and a release layer enables the assembly to be selectively released from the first substrate, enabling non-destructive attachment and detachment from a system board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder mounting is used to attach semiconductor device assembly to system board, then connection strength and reliability are improved, but detachability and ease of repair deteriorate

Engineering Contradiction:

Improveconnection reliabilityVSAvoiddetachability

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

The invention segments the connection system into three distinct parts: the semiconductor device assembly, the flexible member with release layer, and the system board. The flexible member acts as an intermediate component that can be selectively released, allowing the semiconductor device to be detached without damaging the device itself or the system board. This segmentation enables independent replacement of the flexible member while preserving valuable components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The flexible member with its release layer serves as an intermediary component between the semiconductor device assembly and the system board. This mediator provides the desired detachability through the release layer mechanism while maintaining reliable electrical and mechanical connections during operation, thus resolving the contradiction between connection strength and ease of repair.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If solder mounting is used to attach semiconductor device assembly to system board, then mechanical strength of connection is improved, but device replaceability and maintenance ease deteriorate

Engineering Contradiction:

Improveconnection strengthVSAvoiddevice replaceability

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

By segmenting the connection system into modular components (semiconductor device, flexible member, system board), the invention enables selective replacement of only the flexible member when needed, rather than replacing the entire device assembly or system board. This maintains strong connections during normal operation while enabling easy maintenance and component reuse.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention implements a strategy where the flexible member with release layer is designed as a sacrificial component that can be selectively discarded and replaced, while valuable components like the semiconductor device and system board are recovered and reused. This approach balances connection strength with maintenance ease by allowing controlled replacement of only the necessary component.

Inventive Principle:

Principle #34Discarding and recovering

3Reliability

If entire system board must be replaced when semiconductor device fails, then device reliability is maintained, but loss of time and productivity deteriorate

Engineering Contradiction:

Improvesystem reliabilityVSAvoidmaintenance efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The segmented architecture allows the flexible member to be replaced independently without replacing the entire system board or semiconductor device. This significantly reduces maintenance time and improves productivity while maintaining system reliability, as only the failed or wear-prone flexible member needs replacement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention enables selective discarding of only the flexible member component during maintenance, while recovering and reusing the functional semiconductor device and system board. This approach maintains system reliability by ensuring proper replacement of the flexible member while dramatically improving maintenance efficiency and reducing downtime.

Inventive Principle:

Principle #34Discarding and recovering

Data Source

PatentUS10943860B2Semiconductor device with flexible circuit for enabling non-destructive attaching and detaching of device to system board

Publication Date: 2021.03.09 MICRON TECHNOLOGY INC

AI summary

A semiconductor device assembly that includes a flexible member having a first portion connected to a substrate and a connector attached to a second portion of the flexible member. The connector is electrically connected to the substrate via a conducting layer within the flexible member. The substrate may be a semiconductor device, such as a chip. The connector may be configured to connect the semiconductor device to another semiconductor device assembly or a system board, such as a printed circuit board. A material may encapsulate at least a portion of the substrate of the semiconductor assembly. The semiconductor device assembly may be formed by selectively connecting the flexible member to a first substrate. A second substrate and connector may then be connected to the flexible member. A release layer may be used to release the assembly of the second substrate, flexible member, and connector from the first substrate.