Flexible Circuit Assembly with Embedded Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing flex and rigid flex circuits face challenges in maintaining flexibility while accommodating multiple components and efficient heat dissipation, leading to increased size, weight, and manufacturing complexity, especially when integrating surface-mounted devices and heat-generating components.
Innovation Solution
A method is developed to create an ultra-flexible circuit assembly by removing material from non-conductive layers, patterning openings for component attachment, and using automated manufacturing techniques to embed devices within the flexible substrate, enhancing flexibility and heat transfer while minimizing material and process requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If surface-mounted devices are mounted onto the surfaces of flex circuit to accommodate more components, then device integration is improved, but flexibility deteriorates
Solution Approach 1:
The patent merges the device mounting function with the flex circuit substrate itself by creating recesses within the substrate layers. Instead of mounting devices on the surface, devices are embedded within the substrate, combining the substrate and device housing functions into a single integrated structure. This eliminates the rigidity added by surface-mounted components while maintaining device integration.
Solution Approach 2:
The patent implements nesting by placing devices within recesses created inside the multi-layer substrate structure. Devices are nested within the substrate rather than attached externally, allowing the substrate to wrap around and conform to the device shape. This nested configuration maintains flexibility while accommodating multiple devices within the same footprint.
2Temperature
If heat-generating devices are mounted on PCB with thermally conductive substrates and heat sinks, then heat dissipation is improved, but weight and size increase
Solution Approach 1:
The patent extracts the heat sink function from the traditional separate heat sink component and integrates it directly into the flex circuit substrate. The substrate itself is configured to conduct heat away from devices through its layered structure and contact with cooling surfaces, eliminating the need for bulky separate heat sinks and reducing overall weight.
Solution Approach 2:
The patent combines the substrate, device mounting structure, and heat dissipation function into a single integrated flex circuit assembly. The substrate serves multiple functions: structural support, device housing, and thermal conduction path. This merging eliminates separate heat sink components and reduces weight while maintaining effective heat dissipation.
3Adaptability or versatility
If multiple layers of metal and non-conductive substrates are added to flex circuit to increase device capacity, then device integration is improved, but flexibility deteriorates
Solution Approach 1:
The patent segments the substrate into multiple thin layers that can be independently formed and then bonded together. Each layer serves a specific function (conductive, insulating, structural) but the thin-layer construction maintains overall flexibility. The segmented layered structure allows device integration while preserving the flexible nature of the circuit through controlled layer thickness and material selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a highly flexible, cost-effective assembly that reduces stress and weight, enables efficient heat dissipation, and is compatible with automated roll-to-roll manufacturing, addressing the limitations of current technologies in size, weight, and manufacturing complexity.
Implementation Method 1
The flexible substrate is configured to transfer heat away from devices embedded within the flexible substrate
Data Source
AI summary
An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.