Flexible Printed Circuit Encapsulation with Elastic Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional flexible printed circuit encapsulation processes limit the flexibility and fatigue resistance of copper foil, making them unsuitable for applications with large deformation amplitudes and high frequencies, such as wearable devices and flexible displays.
Innovation Solution
A production process for a flexible printed circuit encapsulation structure that integrates a FPC board body, molding tape, elastic support body, and soft rubber jacket, using a mold forming process to create a closely fitted, multi-bend structure with connector assemblies, allowing for large amplitude and high frequency deformation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional direct encapsulation process is used, then the FPC structure is simple, but the flexibility and fatigue resistance are greatly reduced
Solution Approach 1:
The encapsulation structure is divided into multiple functional layers: a rigid support body providing structural strength, a flexible FPC board body with deformation parts for bending flexibility, and a soft rubber jacket for protection and flexibility. This segmentation allows each layer to perform its specific function optimally without compromising the others.
Solution Approach 2:
The patent combines different materials with complementary properties: rigid support body material for structural strength, flexible FPC copper foil for electrical connectivity and bending, and soft rubber material for protection and flexibility. This composite structure achieves both rigidity and flexibility simultaneously.
2Adaptability or versatility
If FPC is used in encapsulation soft body with large deformation amplitude, then the application range is expanded, but the flexibility and fatigue resistance are greatly reduced
Solution Approach 1:
The FPC board body incorporates deformation parts with multiple bends that can dynamically adapt to large amplitude movements. The wave-shaped, triangular, square, V-shaped, or spiral bending patterns allow the FPC to flex and deform elastically without damaging the copper foil, enabling the structure to withstand repeated deformation cycles.
3Stability of the object's composition
If FPC is used in hard rubber package without deformation, then the structural stability is maintained, but the adaptability to flexible applications is limited
Solution Approach 1:
The support body is designed with localized rigid regions to maintain overall structural stability while allowing specific deformation parts in the FPC board body to provide flexibility. The rigid support body provides a stable foundation, while the deformation parts can locally bend and flex without compromising the overall structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables flexible printed circuits to withstand twisting, bending, crimping, and extension while maintaining a stable fit, making them suitable for various products requiring high deformation capabilities, such as wearable and intelligent terminal devices.
Implementation Method 1
a mold forming process for processing the FPC board body and the FPC molding tape into an integrated structure includes a vacuum cast-molding
Implementation Method 2
a mold forming process for processing the FPC board body and the FPC molding tape into an integrated structure includes a mold injection
Implementation Method 3
a mold forming process for processing the FPC board body and the FPC molding tape into an integrated structure includes a mold hot pressing
Implementation Method 4
an elastic support body
Implementation Method 5
performing overmolding on an exterior of an overall structure obtained by assembling the FPC plate body, the FPC molding tape, the elastic support body and the two connector assemblies to form the soft rubber jacket
Data Source
AI summary
The present disclosure provides a production process of a flexible printed circuit encapsulation structure, includes: a FPC overmolding step: processing the FPC board body and the FPC molding tape into an integrated structure to make the FPC board body and the FPC molding tape fit closely each other; a support body assembly step: assembling two connector assemblies on two ends of the elastic support body respectively; a main body assembly step: assembling a combination obtained by the FPC overmolding step and a combination obtained by the support body assembly step; and a soft rubber overmolding step: performing overmolding on an exterior of an overall structure obtained by assembling the FPC plate body, the FPC molding tape, the elastic support body and the two connector assemblies to form the soft rubber jacket. The present disclosure can meet the requirements of larger deformation amplitude, and high deformation frequency.