Image Sensor Package Using Flexible Circuit Board and Adhesive Enclosure
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Solution Overview
Problem
Conventional image sensor packages have a large volume and high cost due to the use of hard materials for the base board with a sidewall, which also interferes with the mounting of the image sensor, and they are not optimized for miniaturization, affecting the size and cost of digital cameras.
Innovation Solution
The design includes a base board with a thin polyimide or polyethylene terephthalate material, a supporter with a through hole, and a cover board that encloses the image sensor, reducing the overall height and volume, and using a main adhesive to package the sensing portion, thereby minimizing dust and water vapor contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a base board with sidewall is used to define the receiving cavity, then the image sensor can be securely mounted, but the volume and cost of the package increases
Solution Approach 1:
The invention removes the sidewall structure from the base board, extracting the problematic element that caused increased volume. The receiving cavity is redefined without the protruding sidewall, allowing the image sensor to be mounted securely through alternative means (adhesive and cover board) while reducing the overall package volume.
Solution Approach 2:
The invention replaces the expensive hard material base board with a combination of flexible circuit board and adhesive materials. The flexible circuit board serves as the mounting substrate, while the adhesive provides the securing function, eliminating the need for costly rigid materials and reducing overall package cost.
2Strength
If hard materials are used for the base board with sidewall, then structural strength is improved, but cost increases
Solution Approach 1:
The invention uses composite material construction combining flexible circuit board, adhesive layers, and cover board to achieve the required structural strength. This composite approach replaces expensive hard materials while maintaining adequate strength through the layered structure and adhesive bonding.
Solution Approach 2:
The invention substitutes expensive hard materials with cheaper flexible circuit board and adhesive materials. The flexible circuit board provides the necessary substrate strength, while the adhesive and cover board combination provides the structural support previously requiring expensive hard materials, thereby reducing manufacturing cost.
3Shape
If the sidewall is formed on the base board, then the receiving cavity is defined, but the image sensor mounting is interfered with
Solution Approach 1:
The invention removes the sidewall structure that was interfering with the mounting process. The receiving cavity is redefined using the flexible circuit board contour and cover board positioning, eliminating the interference caused by the protruding sidewall and enabling easier image sensor placement and alignment.
4Shape
If the base board is made larger to accommodate the sidewall, then the receiving cavity is properly formed, but the overall volume increases
Solution Approach 1:
The invention removes the sidewall structure that required increased base board dimensions. The receiving cavity is formed using the flexible circuit board's natural contour and the cover board's positioning function, eliminating the need for enlarged base board dimensions and reducing overall volume.
Solution Approach 2:
The invention transitions from a three-dimensional sidewall structure to a two-dimensional planar configuration using the flexible circuit board and cover board. This dimensional change allows the receiving cavity to be defined without increasing the base board's footprint or overall package volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a smaller, more cost-effective image sensor package that improves image quality by reducing pollution and facilitating easier assembly and manufacturing, while maintaining electrical connectivity and lens module integration.
Implementation Method 1
The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.
Data Source
AI summary
An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.