Flexible Circuit LED Structures for Compact Packaging
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Solution Overview
Problem
Traditional light-emitting diode (LED) devices have complex packaging requirements that lead to increased production time and costs, and wire bonds with small diameters can be current limiting and add to fabrication complexity.
Innovation Solution
A light-emitting structure featuring a flexible circuit member bonded to a contact bond pad supported by an LED, eliminating the need for wire bonds and allowing for a simplified manufacturing process and reduced profile design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wire bonds with small diameters are used to connect LED contact pads, then the device structure is compact, but the current carrying capacity is limited and fabrication complexity increases
Solution Approach 1:
The patent extracts and eliminates the wire bond component from the LED packaging structure. Instead of using wire bonds to connect contact pads, the invention uses direct bonding of flexible circuit members to the LED contact pads, removing the intermediate wire bond element that limited current capacity and increased fabrication complexity.
Solution Approach 2:
The flexible circuit member is divided into multiple conductive traces that can be independently bonded to different contact pads. This segmentation allows for distributed current paths across the LED surface, increasing overall current carrying capacity while maintaining a compact form factor.
2Reliability
If traditional LED packaging with multiple components (package, wire bonds, current spreading members) is used, then electrical connections are established, but production time and manufacturing costs increase
Solution Approach 1:
The patent combines multiple functions into the flexible circuit member: electrical connection, current distribution, and structural support. This single component replaces the traditional multi-component assembly including separate wire bonds, current spreading members, and rigid packages, significantly reducing manufacturing steps and production time.
Solution Approach 2:
The flexible circuit member serves multiple functions simultaneously: it provides electrical connections to the LED contact pads, distributes current across the LED surface through its conductive traces, and provides mechanical support. This multi-functionality eliminates the need for separate dedicated components for each function.
3Reliability
If complex LED packages with multiple manufacturing steps are used, then reliable electrical connections are achieved, but device complexity and cost increase
Solution Approach 1:
The invention extracts and removes the complex rigid package structure from the LED assembly. The flexible circuit member directly bonds to the LED contact pads without requiring a traditional LED package, eliminating unnecessary structural complexity while maintaining reliable electrical connections.
Data Source
AI summary
Light-emitting structures, and related components, systems, and methods associated therewith are provided. In one embodiment, a light-emitting structure includes at least one LED, a contact bond pad supported by the at least one LED, and a flexible circuit member bonded to the contact bond pad.