Flexible Circuit Mesh Patterning for Drapable Electronics
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Solution Overview
Problem
Traditional methods of manufacturing electronic circuitry are insufficiently flexible and drapable, making them unsuitable for integration into soft goods such as clothing and furniture, lacking durability, adaptability, and ease of integration.
Innovation Solution
The development of drapable electronic circuitry layers through mechanical and chemical subtractive manufacturing methods, which involve removing portions of a conductive mesh to form circuit traces, forming electrical connections, and encasing with an insulative layer, allowing for flexibility and integration into various soft goods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If traditional methods of manufacturing electronic circuitry are used, then circuitry can be produced with standard structural integrity, but the circuitry lacks flexibility and drapability required for soft good integration
Solution Approach 1:
The patent employs a mesh substrate structure that inherently provides flexibility and drapability. The circuit traces are formed by removing portions of this flexible mesh rather than depositing on rigid substrates, allowing the circuitry to conform to soft good surfaces while maintaining structural integrity through the mesh's inherent strength.
Solution Approach 2:
Instead of building up circuitry on a substrate through additive manufacturing, the patent uses subtractive manufacturing by removing material from a complete mesh structure. This inversion of the manufacturing approach enables the circuitry to inherit the flexibility of the underlying mesh while providing the necessary conductive pathways.
2Shape
If subtractive manufacturing methods are used to create flexible circuitry, then flexibility and drapability are improved, but the manufacturing process complexity increases
Solution Approach 1:
The manufacturing process is divided into distinct stages: mesh preparation, pattern definition through masking, selective material removal, and post-processing. This segmentation allows each step to be optimized independently, managing overall process complexity while achieving the desired flexible circuitry structure.
Solution Approach 2:
The patent employs chemical etching processes to remove conductive material from the mesh, replacing what would otherwise require complex mechanical cutting or abrasion systems. This chemical approach simplifies the manufacturing equipment needed while achieving precise circuit trace patterns.
3Shape
If conductive material is removed from mesh to form circuit traces, then flexibility is enhanced, but electrical connection reliability may be compromised
Solution Approach 1:
The mesh substrate and conductive material are prepared in advance with appropriate material selection and structural design before the subtractive process begins. This preliminary preparation ensures that the remaining conductive traces maintain sufficient strength and electrical properties after material removal, preventing connection reliability issues.
Solution Approach 2:
The patent uses composite structures combining the mesh substrate with conductive material coatings or integrations. This composite approach allows the circuit traces to benefit from both the mechanical flexibility of the mesh and the electrical conductivity of the conductive material, maintaining reliability even after selective removal.
4Reliability
If insulative layers are applied to encase circuit traces, then electrical isolation is improved, but the overall flexibility of the circuitry layer may be reduced
Solution Approach 1:
The insulative layers are applied as thin flexible films that conform to the mesh substrate and circuit traces. These thin film insulators provide necessary electrical isolation while maintaining the overall flexibility of the circuitry layer, allowing it to be integrated into soft goods without rigid constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting circuitry layers are flexible, drapable, and durable, with a low bend radius, enabling their integration into a wide range of soft goods while maintaining functionality and resistance to stretching and washing.
Implementation Method 1
applying a chemical to the mesh, wherein the chemical is configured to remove at least a portion of the conductive material not covered by the mask layer
Data Source
AI summary
A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.