Flexible Circuit Board Layout for Thin Multi-Chip Packaging
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Solution Overview
Problem
Conventional flexible circuit boards require multiple substrates and adhesive layers to connect different types of chips, leading to increased thickness, complexity, and reliability issues, particularly in high-resolution display devices where space and efficiency are critical.
Innovation Solution
A flexible circuit board design featuring a single substrate with dual-sided wiring patterns, dummy pattern layers, and tin plating layers, which allows for the simultaneous mounting of various chips on one board, reducing thickness and improving signal transmission while eliminating the need for multiple substrates and adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple substrates and adhesive layers are used to connect different types of chips, then chip connectivity is achieved, but device thickness and structural complexity increase
Solution Approach 1:
The patent merges multiple substrates into a single flexible substrate by integrating different chip mounting areas (first and second chip mounting areas) on opposite surfaces of one substrate. This eliminates the need for multiple separate substrates and adhesive layers, directly reducing device thickness while maintaining the ability to connect different types of chips.
Solution Approach 2:
The patent utilizes the third dimension (z-axis) by mounting chips on opposite surfaces of the flexible substrate. This allows different chip types to be connected without increasing the planar footprint, effectively achieving multi-chip connectivity while keeping the device thin through vertical stacking arrangement.
2Adaptability or versatility
If multiple substrates and adhesive layers are used to connect different types of chips, then chip connectivity is achieved, but structural complexity increases
Solution Approach 1:
The patent combines multiple substrate functions into a single flexible substrate structure that includes first and second chip mounting areas on opposite surfaces. This unified structure eliminates the need for separate substrates and adhesive layers, directly reducing structural complexity while maintaining multi-chip connectivity capabilities.
Solution Approach 2:
The flexible substrate serves multiple functions simultaneously: it acts as the base structure, provides mounting areas for different chip types on opposite surfaces, and eliminates the need for separate adhesive layers. This multi-functionality reduces the number of components and simplifies the overall structure.
3Adaptability or versatility
If multiple substrates and adhesive layers are used, then chip mounting is achieved, but reliability decreases
Solution Approach 1:
The patent integrates multiple chip mounting functions into a single flexible substrate, eliminating the need for adhesive layers that would introduce potential failure points. By directly mounting chips on the substrate surfaces, the design reduces the number of interfaces and potential reliability issues associated with adhesive bonding.
4Ease of manufacture
If solder resist printing is performed without considering dummy patterns, then manufacturing is simplified, but pinholes are generated reducing quality
Solution Approach 1:
The patent introduces dummy patterns in advance of the actual chip mounting areas. These dummy patterns are printed together with the real wiring patterns during the solder resist printing process, ensuring uniform printing conditions across the entire substrate surface. This preliminary action prevents pinholes and printing defects that would occur in areas without underlying patterns.
Solution Approach 2:
The dummy patterns are designed to replicate the structure and printing characteristics of the actual wiring patterns. By creating copy patterns in areas where no chips will be mounted, the solder resist printing process experiences consistent surface conditions, preventing pinholes and ensuring uniform coating quality across the entire flexible substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and efficiency of chip packaging by reducing the overall thickness of electronic devices, improving signal transmission, and simplifying the manufacturing process, making it suitable for high-resolution display units.
Implementation Method 1
a first plating layer including tin (Sn) disposed on the first wiring pattern layer; and a second plating layer including tin (Sn) disposed on the second wiring pattern layer
Data Source
AI summary
A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.