Flexible Printed Circuit Overlap for Display Signal Noise

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Solution Overview

Problem

The interference between flexible printed circuit boards in display devices and the increased area they occupy pose challenges in the design of flat panel displays, particularly in touch sensing applications.

Innovation Solution

The design incorporates a first and second flexible printed circuit board with specific configurations, including openings and overlapping structures, to minimize interference and reduce the occupied area, allowing for efficient signal transmission between the display panel and touch sensing layers without causing cracks or electrical noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple flexible printed circuit boards are used to transmit signals for display and touch sensing functions, then signal transmission capability is improved, but interference between the circuit boards and electrical noise increase

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidinterference and electrical noise
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a planar arrangement of flexible printed circuit boards to a three-dimensional overlapping configuration. The second FPCB is positioned to overlap the first FPCB at an angle, creating spatial separation in the vertical dimension while maintaining compact footprint. This dimensional change reduces electromagnetic interference between the circuits while preserving signal transmission functionality for both display and touch sensing operations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested arrangement where the second flexible printed circuit board is positioned to overlap and partially cover the first flexible printed circuit board. This nesting configuration allows both circuit boards to coexist in a limited space while minimizing their mutual interference. The overlapping structure enables the second FPCB to be effectively 'nested' within the spatial envelope of the first FPCB, reducing the overall area occupied while maintaining separate signal paths.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If flexible printed circuit boards are added for touch sensing functionality, then device functionality is improved, but the area occupied by the circuit boards increases

Engineering Contradiction:
Improvedevice functionalityVSAvoidarea occupied by circuit boards
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent utilizes three-dimensional spatial arrangement to accommodate multiple flexible printed circuit boards within a reduced two-dimensional footprint. By overlapping the second FPCB onto the first FPCB at an angle, the design effectively uses the vertical dimension to pack more functionality into the same planar space, thereby reducing the overall area occupied while maintaining both display and touch sensing capabilities.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The nested overlapping configuration allows the second flexible printed circuit board to be positioned within the spatial envelope of the first FPCB. This nesting approach enables both circuit boards to share the same physical space without requiring additional lateral area, thus maintaining compact device dimensions while adding touch sensing functionality through the second FPCB.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS9992862B2Display device with overlapping flexible printed circuits
Publication Date: 2018.06.05 SAMSUNG DISPLAY CO LTD
  • US9992862B2 patent drawing
  • US9992862B2 patent drawing
  • US9992862B2 patent drawing

AI summary

A display device includes: a lower substrate; an upper substrate facing the lower substrate; a printed board assembly disposed on a rear surface of the lower substrate; a first flexible printed circuit board having a first end and a second end that are respectively connected to the lower substrate and the printed board assembly; and a second flexible printed circuit board having a first end and a second end that are respectively connected to the upper substrate and the printed board assembly. One of the first flexible printed circuit board and the second flexible printed circuit board has an opening at a central portion, and the other flexible printed circuit board at least partially overlaps the opening in a plane view.