Flexible Circuit Board Pad Edge Buffering

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Solution Overview

Problem

Conventional flexible circuit boards are prone to scratching or abrasion of electrically conductive pads during assembly into connector terminals due to the bent inclined surface of the connector's elastic flat pieces, leading to potential disconnection.

Innovation Solution

The flexible circuit board design features electrically conductive pads with front ends that do not reach the substrate's edge, instead being separated by a distance of 0.1-0.5 mm, with arc or trapezoid surfaces to act as a buffer and guide for smooth connector alignment, preventing abrasion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the front ends of electrically conductive pads are aligned with the front edge of the flexible substrate, then the connector terminal can be easily assembled, but the bent inclined surface of the elastic flat piece may scratch the electrically conductive pads or cause them to depart from the substrate

Engineering Contradiction:
ImproveAssembly easeVSAvoidElectrical connection reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent applies preliminary anti-action by pre-positioning the electrically conductive pads at a distance from the front edge of the flexible substrate. This advance positioning prevents the harmful scratching action by the bent inclined surface of the elastic flat piece during connector assembly, eliminating the need for protective measures during the actual assembly process

Inventive Principle:
Principle #9Preliminary anti-action

Solution Approach 2:

The patent introduces an intermediary spatial buffer zone between the electrically conductive pads and the front edge of the flexible substrate. This distance buffer acts as a mediator that absorbs the harmful mechanical action of the connector terminal's elastic flat piece, preventing direct contact between the scratching surface and the conductive pads

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If the electrically conductive pads are positioned close to the front edge of the flexible substrate, then the device size is minimized, but the pads are vulnerable to scratching and removal during connector insertion

Engineering Contradiction:
ImproveDevice areaVSAvoidScratching and abrasion risk
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent implements beforehand cushioning by creating a protective distance buffer between the electrically conductive pads and the front edge of the flexible substrate. This pre-established spatial cushion absorbs the mechanical stress and scratching action from the connector terminal's elastic flat piece, protecting the pads without requiring additional protective structures

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS7291037B2Flexible circuit board
Publication Date: 2007.11.06 CHICONY ELECTRONICS CO LTD
  • US7291037B2 patent drawing
  • US7291037B2 patent drawing
  • US7291037B2 patent drawing

AI summary

A flexible circuit board is provided, comprising a flexible substrate having an upper surface and a lower surface and a plurality of electrically conductive pads overlaid on an upper surface of the flexible substrate. Front ends of the electrically conductive pads do not reach a front edge of the flexible substrate and are separated from the front edge of the flexible substrate by a distance.