Flexible Printed Circuit Pin Grouping for Flat Panel Display Bonding
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Solution Overview
Problem
Conventional flat panel displays face challenges in increasing the number of electrical connections between flexible printed circuits without causing short-circuits, which reduces production yield due to insufficient bonding area and increased gap between connections.
Innovation Solution
The solution involves grouping pins on the first flexible printed circuit into different groups located on opposite sides, with positioning holes for alignment and pre-soldering layers to enhance bonding accuracy and space utilization, preventing short-circuits and improving signal transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the number of electrical connections is increased to meet high resolution and high response speed requirements, then the display quality and functionality are improved, but the bonding area between connections becomes insufficient and the gap between adjacent connections decreases, likely causing short-circuits during soldering
Solution Approach 1:
The pins are divided into multiple groups (first group, second group, third group) with different spatial arrangements. The first group has pins arranged in a first direction, the second group in a second direction, and the third group in a third direction. This segmentation allows each group to be positioned optimally for bonding while maintaining sufficient gap between adjacent connections, thus preventing short-circuits during soldering while meeting high connection count requirements
Solution Approach 2:
The patent transitions from a single-plane pin arrangement to a multi-dimensional configuration by arranging pins in different groups with different spatial orientations. The first, second, and third groups are positioned at different locations and orientations on the flexible printed circuit, utilizing multi-dimensional space to increase bonding area and reduce gap between adjacent connections, thereby eliminating short-circuit risks
2Productivity
If the number of electrical connections is increased to achieve high resolution and high response speed, then the display performance is improved, but the bonding area between connections remains insufficient, reducing production yield
Solution Approach 1:
By segmenting pins into multiple groups with different spatial arrangements, the patent maximizes the utilization of bonding area. Each group can be positioned to optimize its bonding interface, allowing more connections to be made within the same bonding area without compromising connection quality, thus increasing production yield
Solution Approach 2:
The multi-dimensional arrangement of pins in different groups (first, second, and third groups with different orientations and positions) effectively increases the bonding area by utilizing space in multiple dimensions. This allows more electrical connections to be established within the same physical bonding region, thereby increasing production yield without sacrificing connection integrity
Data Source
AI summary
A flat panel display includes a display screen, a first flexible printed circuit, and a second flexible printed circuit. The second flexible printed circuit has a plurality of pads and is electrically connected to the display screen. The first flexible printed circuit is electrically connected between the display screen and the second flexible printed circuit and has a plurality of pins corresponding to the pads. The pins are divided into a plurality of groups, and each the group is respectively located at the different sides of the first flexible.