Flexible Circuit Film Power Layout to Prevent Local Overheating
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Solution Overview
Problem
Existing display apparatuses face inefficiencies in wiring layout and power distribution, leading to potential overheating due to current concentration, which affects the performance and reliability of flexible circuit films in display devices.
Innovation Solution
A flexible circuit film design with a base film, integrated circuit chip, and distinct power and data wiring layouts, including separate connection parts for efficient power distribution and reduced current concentration, utilizing anisotropic conductive films for connectivity between the circuit film and driving circuit units, and display panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power wirings are concentrated in a single location on the flexible circuit film, then the wiring layout is simplified, but current concentration occurs leading to local overheating
Solution Approach 1:
The power distribution system is segmented into multiple connection parts (first connection part and second connection part) spaced apart on the flexible circuit film. This divides the current flow path into separate segments, preventing current concentration in a single location and thereby reducing local overheating while maintaining wiring layout simplicity
2Reliability
If multiple connection parts are used to distribute power wirings, then current concentration is reduced and overheating is prevented, but the wiring layout complexity increases
Solution Approach 1:
Different regions of the flexible circuit film are assigned different functions: the first connection part is disposed adjacent to the first power input terminal and first power output terminals, while the second connection part is spaced apart and disposed adjacent to the second power input terminal and second power output terminals. This local differentiation optimizes power distribution and thermal management without requiring complex overall wiring redesign
Data Source
AI summary
A flexible circuit film includes the following elements: a base film; a first power input terminal, a second power input terminal, a first power output terminal, and a second power output terminal each disposed on the base film; an integrated circuit chip disposed between the first power input terminal and the first power output terminal and overlapping the base film; first power wiring disposed on the base film, connecting the first power input terminal to the first power output terminal, and including a first connection part; and second power wiring disposed on the base film, connecting the second power input terminal to the second power output terminal, and including a second connection part. The first connection part and the second connection part are disposed between the base film and the integrated circuit chip, overlap the integrated circuit chip, and are spaced from each other.