Flexible Multilayer Circuit Layout for Reliable Power Routing
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Solution Overview
Problem
In electronic devices with bent circuit substrates, providing power source input terminals to rigid parts reduces component mounting areas, while omitting them from rigid parts necessitates flexible part wiring, leading to noise interference and disconnection issues.
Innovation Solution
A multilayer circuit substrate with flexible parts between rigid parts, where power source positive electrode wirings extend between component mounting parts on different layers, allowing partial superposition and reducing wiring width, ensuring continued power supply even if one wiring disconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power source input terminals are provided to each rigid part, then power supply reliability is improved, but component mounting areas are reduced
Solution Approach 1:
The power source input terminal is extracted from one of the rigid parts, concentrating it on a single rigid part. This extraction eliminates the need for the terminal on the other rigid part, thereby preserving component mounting area while maintaining power supply functionality through alternative routing via the flexible part.
Solution Approach 2:
The flexible part serves as an intermediary carrier for the power source positive electrode wiring. By routing power supply wiring through the flexible part instead of providing terminals on both rigid parts, the solution mediates between the need for power supply reliability and the need to preserve component mounting areas.
2Area of stationary object
If power source input terminals are omitted from rigid parts, then component mounting areas increase, but noise interference and disconnection issues occur
Solution Approach 1:
The power source positive electrode wirings are arranged in different layers (vertical dimension) of the multilayer circuit substrate, allowing them to be superimposed when projected. This dimensional arrangement reduces the wiring width required in the horizontal plane, minimizing noise interference with signal wirings while maintaining adequate power supply capability.
Solution Approach 2:
The circuit substrate utilizes a multilayer composite structure with flexible and rigid parts having different thicknesses and properties. The flexible part is made thinner to enhance flexibility and reduce wiring width, while the rigid parts provide structural support and component mounting areas, creating a composite solution that addresses both noise reduction and mounting requirements.
3Area of stationary object
If flexible part wiring is used to supply power, then component mounting areas increase, but disconnection issues occur
Solution Approach 1:
The power source positive electrode wiring is divided into multiple separate wirings (at least two) that extend between the component mounting parts. This segmentation ensures that if one wiring becomes disconnected, the other wirings can maintain power supply continuity, thereby improving reliability while using the flexible part structure.
Solution Approach 2:
The thickness parameter of the flexible part is changed to be thinner than the rigid parts, which enhances flexibility and reduces the likelihood of disconnection. Additionally, the arrangement of multiple wirings in different layers provides parameter redundancy, ensuring power supply continuity even if one wiring fails.
Data Source
AI summary
A bendable circuit substrate (3) is provided with a first rigid part (11), a second rigid part (12) and a flexible part (13). The first rigid part (11) is provided with power source terminals (40) (positive electrode terminal (40A), negative electrode terminal (40B)), and power is supplied to the second rigid part (12) via power source positive electrode wirings (BA) of the flexible part (13). The power source positive electrode wirings (BA) are provided to the respective first layer and the second layer so as to be superimposed on each other in the lamination direction, in the flexible part (13).